In order to improve the bi-directional overload capability of differential pressure sensors， a beam-archipelago dislocated membrane structure differential pressure sensitive element was designed in this paper. The sensitive element consisted of a beam-archipelago silicon membrane structure bonded to a glass substrate. The beam structure reduced the stress concentration， and the archipelago structure improved the structural rigidity； the glass substrate was designed with square grooves and circular through holes on the bonding surface， and the dislocation structure formed by the square grooves of the silicon membrane structure and the glass substrate further reduced the maximum stress. Firstly， the stress distribution， full-scale output， and maximum stress of the bi-directional high overload silicon-based differential pressure sensitive element were analyzed using finite element software. Secondly， the relationship between structural dimensions and burst pressure was analyzed， and the structural dimensions at maximum burst pressure were solved through dimensional optimization. Finally， a silicon-based differential pressure sensitive element with bi-directional high overload was fabricated using the MEMS silicon process. The pressure test results show that the fabricated bi-directional high overload silicon-based differential pressure sensitive element has a burst pressure of 8.5 times scale， which is 30.7% higher overload capacity compared with the traditional C-type membrane structure differential pressure sensitive element （burst pressure 6.5 times scale）. The experimental results demonstrate that the beam-archipelago dislocation membrane structure can effectively improve the bi-directonal overload capacity of the differential pressure sensitive element.