[1] [1] SANDRA L B,PAUL J B,CHARLES L C,et al.. Automatic solder joint inspection[J]. IEEE Transaction on Pattern Analysis and Machine Intelligence,1988,10(1):31-43.

[2] [2] KIM J H,CHO H S,KIM S. Pattern classification of solder joint images using a correlation neural network [J]. Eng. Applic. Intell.,1996,9(6):655-669.

[3] [3] KIM T H,CHO T H,MOON Y S,et al.. Visual inspection system for the classification of solder joints [J].Pattern Recognition,1999,32(4):565-575.

[4] [4] KO K W,CHO H S. Solder joints inspection using a neural network and fuzzy rule-based classification method [J].IEEE Transactions on Electronics Packaging Manufacturing,2000,23(2):93-102.

[5] [5] ACCIANI G ,BRUNETTI G ,CHIARANTONI E,et al.. An automatic method to detect missing devices in manufactured products[C]. Proceedings of International Joint Conference on Neural Networks,2005: 2324-2329.

[6] [6] LI ZH M,LIN Y W,HUANG J,et al.. Pre-process algorithm of PCB line detecting [J].Opt. Precision Eng.,2007,15(2):272-276. (in Chinese)

[7] [7] LIU J Q,KUANG H,DING SH H. Reseach on machine vision system for inspection of SMT chip pins[J].China Mechanical Engineering,2007,18(16):1908-1912. (in Chinese)

[8] [8] WU H H,ZHANG X M,KUANG Y C,et al.. A real-time machine vision system for solder paste inspection[C].IEEE/-ASME International Conference on Advanced Intelligent Mechatronics,2008:205-210.

[9] [9] MICHAEL E Z,STEFANOS K G ,GEORGE A R. A Bayesian framework for multilead SMD post-placement quality inspection [J]. IEEE Transactions on Systems,Man,and Cybernetics-part B:Cybernetics,2004,34(1):440-453.

[10] [10] XIAN F. Testing technology development promoted by HDI packaging technology [J].Equipment for Electronics Manufacturing,2008,157:32-35. (in Chinese)

[11] [11] NORRIS M J. Vectorial imaging: the new direction in automatic optical inspection [R/OL]. http://www.vitechnology.com/img- /data/Vectoral_Imaging.PDF.

[12] [12] ROBERT E B,JOSHUA S,STEPHEN M P,et al.. A statistical appearance model based on intensity quantile histograms[C]. IEEE International Symposium on Biomedical Imaging,2006:422-425.

[13] [13] LU SH L,ZHAN X M. Analysis and optimal design of illuminator for leadless tin solder joint inspection [J]. Opt. Precision Eng.,2008,16(8):1377-1383. (in Chinese)

[14] [14] WANG N,LI J. Segmentation method of multi-level automobile license location [J].Journal of AnHui University (Natural Sciences),1999,23(2):57- 62. (in Chinese)

[15] [15] GONZALEZ R C,WOODS R E,RUAN Q Y,et al.. Digital Image Processing [M]. Beijing: Publishing House of Electronics Industry,2003:229-235. (in Chinese)