Optics and Precision Engineering, Volume. 17, Issue 9, 2283(2009)

Inspection of surface mounted IC devices with edge and color features

WU Hui-hui*, ZHANG Xian-min, and HONG Shi-liang
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  • [in Chinese]
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    In order to satisfy the on-line inspection requirements of the surface mounted Integrated Circuit(IC) devices on Printed Circuit Boards (PCB),an inspection algorithm based on the edge integral projection and color statistical features was presented. The features of the IC devices with different mounted qualities under a three-color (red,greed,blue) structure light source were analyzed. Then,the horizontal and vertical edges were extracted with the Sobel arithmetic operator and the edges were projected for avoiding the difficulty of right thresholding. Based on the integral projections of the edges,the horizontal and vertical borders of the IC leads were obtained by the maximum neighbor gradient algorithm and the sliding location window algorithm,respectively. After location the leads,the defects such as missing devices,wrong devices,shifts and skews were inspected. Finally,the statistical color features in HSI (hue,saturation,intensity) space were extracted to detect the defects of lift leads and wrong polarity. Experiment results show that the proposed method can identify the defects of the IC devices effectively,the total success rate is 97.9% and the time consuming for single IC device is about 30 ms. It has verified the validity of this algorithm in terms of the recognition rate and speed.

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    WU Hui-hui, ZHANG Xian-min, HONG Shi-liang. Inspection of surface mounted IC devices with edge and color features[J]. Optics and Precision Engineering, 2009, 17(9): 2283

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    Paper Information

    Category:

    Received: Jan. 11, 2009

    Accepted: --

    Published Online: Oct. 28, 2009

    The Author Email: WU Hui-hui (wuhuihui215@sohu.com)

    DOI:

    CSTR:32186.14.

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