[3] Y S GAO, W JIANG. Wideband photonic RF transceiver with zero-if architecture, 23-26(2017).

[4] J M CHEN, L LI, P ZHANG et al. Design of uat transceiver based on zif architecture, 2132-2137(2022).

[5] S L ZHU, Y L ZHANG, K LIU et al. Design and implementation of portable and re-configurable unmanned aerial vehicle（UAV） detection radar based on ADRV9040 and MPSoC, 516-520(2025).

[6] T M HANCOCK, J DEMMIN. Heterogeneous and 3D integration at DARPA, 27-29(2019).

[11] C LI, P ZHANG, S F LI. An overview on the development of chip-scale integrated microsystems. Journal of CAEIT, 5, 1-10(2010).

[14] S RAMAN, C L DOHRMAN, T H CHANG et al. The DARPA diverse accessible heterogeneous integration （DAHI） program：convergence of compound semiconductor devices and silicon-enabled architectures, 1-6(2012).

[15] B MCMAHON, R LAPIERRE, A MACCABE et al. ORCHESTRA：optimizable RF converged hardware expression of a scalable transmit/receive architecture, 2139-2140(2018).

[16] A D CARTER, M E URTEAGA, Z M GRIFFITH et al. Q-band InP/CMOS receiver and transmitter beamformer channels fabricated by 3D heterogeneous integration, 1706-1763(2017).

[17] J ZHANG, Y ZENG, D SHAO et al. Research progress and prospect of silicon-based RF microsystems, 1-3(2023).

[18] E D ERICK, W KE. Frequency-agile dual-band direct conversion receiver for cognitive radio systems. IEEE Transactions on Microwave Theory and Techniques, 58, 87-94(2010).

[19] J G ZHANG. Multi chip component technology in the 1990s. Electronic Components and Materials, 58-61(1993).

[22] F YU, Q ZHOU, Z WANG et al. Design and implementation of RF front-end module based on 3D heterogeneous integrated wafer-level packaging. Electronics, 10, 1893(2021).

[27] W FENG, X WANG, Z G SHI et al. Research on high-speed detection method of radar signal based on RFSoC, 1091-1094(2024).

[28] M S LIN, T C HUANG, C C TSAI et al. A 7-nm 4-GHz ARM-core-based CoWoS chiplet design for high-performance computing. IEEE Journal of Solid-State Circuits, 55, 956-966(2020).

[30] S J WU, H C HSU, W F LIN et al. Rapid laser drilling on thick ceramic substrates for SiP applications, 430-433(2018).

[31] S W HO, S W YOON, Q ZHOU et al. High RF performance TSV silicon carrier for high frequency application, 1946-1952(2008).

[32] G PARES, P M JEAN, D EDOUARD et al. Highly compact RF transceiver module using high resistive silicon interposer with embedded inductors and heterogeneous dies integration, 1279-1286(2019).

[34] C XIA, H WANG, G WANG et al. Advanced Packaging of 3D Fan-out RF Microsystem for 5G IoT Communication, 1-4(2020).