NUCLEAR TECHNIQUES, Volume. 47, Issue 4, 040402(2024)

Transient radiation response of SOI transistors and SOI devices

Chuanhua DU, Binghuang DUAN*, Cen XIONG, and Chao ZENG
Author Affiliations
  • Institute of Electronic Engineering, China Academy of Engineering Physics, Mianyang 621900, China
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    Figures & Tables(13)
    Layout of the tested device
    Photocurrent IDS vs. drain-source voltage VDS irradiated with different laser energies for the three types of transistors
    Waveform of measured photocurrent IDS of drain-source under different laser energies for two types of transistors(a) 0.35 μm SOI NMOS, (b) 0.35 μm Si NMOS
    MCU test circiut
    Block diagram of gamma dose rate test method for MCU circuit
    Transient dose rate radiation response of the square wave signal of an MCU circuit (dose rate: 4.2×1011 rad(Si)·s-1)
    Transient source current of an MCU circuit(dose rate: 4.2×1011 rad(Si)·s-1)
    Transient dose rate response of the 3.3 V MCU voltage (dose rate: 4.2×1011 rad(Si)·s-1)
    Transient dose rate response of the 1.2 V MCU voltage (dose rate: 4.2×1011 rad(Si)·s-1)
    Transient dose rate response of an oscillator voltage (dose rate: 4.2×1011 rad(Si)·s-1)
    Test results of logic states of a trigger flip-flop chain after gamma irradiation
    Schematic diagram of sensitive charge collect volume for bulk Si (a) and SOI MOS (b)
    • Table 1. Information on laser-tested devices

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      Table 1. Information on laser-tested devices

      序号

      Sample ID

      工艺节点

      Process node / μm

      工艺特点

      Fabrication technology

      晶体管类型

      Transistor type

      宽长比

      W/L

      10.13SOIBTS NMOS20 μm/5 μm
      20.35SOIBTS NMOS20 μm/5 μm
      30.35Bulk SiBTS NMOS20 μm/5 μm
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    Chuanhua DU, Binghuang DUAN, Cen XIONG, Chao ZENG. Transient radiation response of SOI transistors and SOI devices[J]. NUCLEAR TECHNIQUES, 2024, 47(4): 040402

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    Paper Information

    Category: Research Articles

    Received: Jul. 23, 2023

    Accepted: --

    Published Online: May. 28, 2024

    The Author Email: Binghuang DUAN (段丙皇)

    DOI:10.11889/j.0253-3219.2024.hjs.47.040402

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