Optoelectronic Technology, Volume. 43, Issue 1, 1(2023)
(100) and (111) Selective De⁃substrate Technology after Whole⁃sheet Bonding of Silicon⁃based Metals
Fig. 1. Process steps for silicon-based metal wafer bonding followed by selective de-substrate technology
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Jiayi DU, Junyang NIE, Jie SUN, Chang LIN, Dalei WU, Tianxi YANG, Zhonghang HUANG, Qun YAN. (100) and (111) Selective De⁃substrate Technology after Whole⁃sheet Bonding of Silicon⁃based Metals[J]. Optoelectronic Technology, 2023, 43(1): 1
Category: Research and Trial-manufacture
Received: Sep. 8, 2022
Accepted: --
Published Online: Apr. 14, 2023
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