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Bulletin of the Chinese Ceramic Society, Volume. 44, Issue 2, 707(2025)

Application and Performance Requirements of Glass Substrates in Chip Packaging

ZHANG Xingzhi1, TIAN Yingliang1,2、*, ZHAO Zhiyong1,2, ZHANG Xun1,3, and WANG Ruzhi1
Author Affiliations
  • 1College of Materials Science and Engineering, Beijing University of Technology, Beijing 100124, China
  • 2National Engineering Research Center of FPD Glass Technology, Xianyang 712023, China
  • 3WG Tech (Jiang Xi) Co., Ltd.， Xinyu 338004, China
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    ZHANG Xingzhi, TIAN Yingliang, ZHAO Zhiyong, ZHANG Xun, WANG Ruzhi. Application and Performance Requirements of Glass Substrates in Chip Packaging[J]. Bulletin of the Chinese Ceramic Society, 2025, 44(2): 707

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    Paper Information

    Received: Aug. 5, 2024

    Accepted: Mar. 31, 2025

    Published Online: Mar. 31, 2025

    The Author Email: TIAN Yingliang (tianyl@bjut.edu.cn)

    DOI:10.16552/j.cnki.issn1001-1625.2024.0916

    Topics

    laser devices and laser physics
    Lasers and Laser Optics
    Laser physics
    laser manufacturing
    Instrumentation, Measurement and Metrology