Microelectronics, Volume. 54, Issue 2, 255(2024)
Progress on Embedded Bridge Packaging for Chiplet Integration
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YUAN Yuan, ZHANG Zhimo, ZHU Yuan, MENG Dexi, LIU Shuli, WANG Gang. Progress on Embedded Bridge Packaging for Chiplet Integration[J]. Microelectronics, 2024, 54(2): 255
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Received: Oct. 8, 2023
Accepted: --
Published Online: Aug. 21, 2024
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