During the post-Moore law period, one of the most effective means to delay the life of Moore’s law is achieving multifunctional, high-density, and miniaturized integration of functional and heterogeneous chiplets through advanced packaging technology. Among these blossoming solutions, embedding a silicon bridge chip into a substrate or interposer can solve the problem of local high-density signal interconnection between chiplets at a relatively lower cost than the through silicon via(TSV) interposer. Therefore, embedded bridge packaging is considered a compromise between the performance and cost of chiplets and heterogeneous integration in the industry. Several typically advanced packaging solutions based on bridge interconnection in the industry are summarized in this paper, and their process flow and technical difficulties are presented. Finally, the developmental direction of this type of advanced packaging technology is described.