Journal of Infrared and Millimeter Waves, Volume. 42, Issue 6, 747(2023)

Research on watt-level power combining technology at terahertz band based on bonding wire compensation

Xiang ZHU1,2, Jun-Jie ZHANG3, Hai-Feng CHENG2, Jian GUO3、*, Yong-Rong SHI1、**, and Wei-Bo WANG2
Author Affiliations
  • 1Key Laboratory of Dynamic Cognitive System of Electromagnetic Spectrum Space,Ministry of Industry and Information Technology,Nanjing University of Aeronautics and Astronautics,Nanjing 211106,China
  • 2Nanjing Electronic Device Institute,Nanjing 210016,China
  • 3State Key Laboratory of Millimeter Waves,Southeast University,Nanjing 210096,China
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    References(22)

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    Xiang ZHU, Jun-Jie ZHANG, Hai-Feng CHENG, Jian GUO, Yong-Rong SHI, Wei-Bo WANG. Research on watt-level power combining technology at terahertz band based on bonding wire compensation[J]. Journal of Infrared and Millimeter Waves, 2023, 42(6): 747

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    Paper Information

    Category: Research Articles

    Received: Nov. 10, 2022

    Accepted: --

    Published Online: Dec. 26, 2023

    The Author Email: Jian GUO (jguo@seu.edu.cn), Yong-Rong SHI (yongrongshi@nuaa.edu.cn)

    DOI:10.11972/j.issn.1001-9014.2023.06.007

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