Fig. 1. THz-band E-plane probe simulation structure, (a) three-dimensional model, (b) key dimensions

Fig. 2. THz-band E-plane probe simulation results

Fig. 3. Gold wire bonding, (a) equivalent circuit, (b) figure and port schematic

Fig. 4. Low pass filter with gold wire compensation

Fig. 5. Comparison of parameter S with and without compensation structure

Fig. 6. Parameter S corresponding to different gap widths

Fig. 7. Module with gold wire compensation and test results

Fig. 8. THz-band overmoded waveguide E-plane T-junction combiner, (a) simulation model, (b) section

Fig. 9. Simulation results of THz-band overmoded waveguide E-plane T-junction combiner

Fig. 10. Model of THz-band E-plane four-way waveguide combiner, (a) simulation model, (b) figure

Fig. 11. THz-band E-plane four-way waveguide combiner, (a)insertion and return losses, (b) phase consistency

Fig. 12. Simulation model of internal cavity of unit power module

Fig. 13. Unit power module pass-through simulation results

Fig. 14. THz-band power amplifier unit module

Fig. 15. THz-band amplifier unit module test results

Fig. 16. Photo of sixteen-way power combining amplifier

Fig. 17. Test results of THz-band solid-state power amplifier

Fig. 18. Combining efficiency curve of THz-band solid-state power amplifier