[1] MILISAVLJEVIC I, ZHANG G, WU Y. Solid-state single-crystal growth of YAG and Nd∶YAG by spark plasma sintering[J]. Journal of Materials Science & Technology, 106, 118-127(2022).

[2] FENG Z, MA C Y, ZHANG C G et al. Transparent YAG ceramic/sapphire composite fabricated by pressureless direct thermal diffusion bonding[J]. Journal of the European Ceramic Society, 41, 7845-7851(2021).

[3] NEGRI J R, PIRZIO F, AGNESI A. Jitter investigation of narrow-bandwidth passively Q-switched Nd： YAG unidirectional ring laser[J]. Optics Letters, 44, 3094-3097(2019).

[4] BORDATCHEV E V, HAFIZ A M K, TUTUNEA-FATAN O R. Performance of laser polishing in finishing of metallic surfaces[J]. The International Journal of Advanced Manufacturing Technology, 73, 35-52(2014).

[5] SACHDEVA A, PICKERING E M, LEE H J. From electrocautery， balloon dilatation， neodymium-doped： yttrium-aluminum-garnet （Nd∶YAG） laser to argon plasma coagulation and cryotherapy[J]. Journal of Thoracic Disease, 7, S363-S379(2015).

[6] MINCUZZI G, PALMA A L, DI CARLO A et al. Laser processing in the manufacture of dye-sensitized and perovskite solar cell technologies[J]. ChemElectroChem, 3, 9-30(2016).

[7] [7] 位超杰， 闫仁鹏， 李旭东， 等. 三维成像激光雷达应用的亚纳秒激光器研究进展［J］. 光学 精密工程， 2021， 29（6）：1270-1280. doi: 10.37188/ope.20212906.1270WEICH J， YANR P， LIX D， et al. Research progress of sub-nanosecond lasers for 3D imaging lidar［J］. Opt. Precision Eng.， 2021， 29（6）：1270-1280.（in Chinese）. doi: 10.37188/ope.20212906.1270

[8] ROSS D, YAMAGUCHI H. Nanometer-scale characteristics of polycrystalline YAG ceramic polishing[J]. CIRP Annals, 67, 349-352(2018).

[9] MCKAY J, BAI T Y, GOORSKY M S. Chemical mechanical polishing and direct bonding of YAG[J]. ECS Transactions, 86, 217-222(2018).

[10] PEI Z J, FISHER G R, LIU J. Grinding of silicon wafers： a review from historical perspectives[J]. International Journal of Machine Tools and Manufacture, 48, 1297-1307(2008).

[11] [11] 刘宁， 朱永伟， 李学， 等. 硬脆材料平面研抛的材料去除机理研究进展［J］. 材料导报， 2022， 36（7）：80-91. doi: 10.11896/cldb.21060121LIUN， ZHUY W， LIX， et al. Research progress of material removal mechanism in plane lapping and polishing of hard-brittle materials［J］. Materials Review， 2022， 36（7）：80-91.（in Chinese）. doi: 10.11896/cldb.21060121

[12] [12] 袁巨龙， 王志伟， 文东辉， 等. 超精密加工现状综述［J］. 机械工程学报， 2007， 43（1）：35-48. doi: 10.3321/j.issn:0577-6686.2007.01.006YUANJ L， WANGZH W， WEND H， et al. Review of the current situation of ultra-precision machining［J］. Chinese Journal of Mechanical Engineering， 2007， 43（1）：35-48.（in Chinese）. doi: 10.3321/j.issn:0577-6686.2007.01.006

[13] SUN J L, CHEN P, QIN F et al. Modelling and experimental study of roughness in silicon wafer self-rotating grinding[J]. Precision Engineering, 51, 625-637(2018).

[14] ZHANG C Y, GUO B, ZHAO Q L et al. Ultra-precision grinding of AlON ceramics： surface finish and mechanisms[J]. Journal of the European Ceramic Society, 39, 3668-3676(2019).

[15] JIANG B C, ZHAO D W, LIU Y H et al. Surface figure control in fine rotation grinding process of thick silicon mirror[J]. The International Journal of Advanced Manufacturing Technology, 98, 771-779(2018).

[16] [16] 高尚， 李天润， 郎鸿业， 等. 工件旋转法磨削硅片的亚表面损伤深度预测［J］. 光学 精密工程， 2022， 30（17）：2077-2087. doi: 10.37188/OPE.20223017.2077GAOSH， LIT R， LANGH Y， et al. Prediction for subsurface damage depth of silicon wafers in workpiece rotational grinding［J］. Opt. Precision Eng.， 2022， 30（17）：2077-2087.（in Chinese）. doi: 10.37188/OPE.20223017.2077

[17] [17] 李琛. 稀土氧化物激光晶体超精密磨削机理及工艺研究［D］. 哈尔滨： 哈尔滨工业大学， 2019.LIC. Study on Ultra-precision Grinding Mechanism and Technology of Rare Earth Oxide Laser Crystal［D］. Harbin： Harbin Institute of Technology， 2019. （in Chinese）

[18] LI C, LI X L, WU Y Q et al. Deformation mechanism and force modelling of the grinding of YAG single crystals[J]. International Journal of Machine Tools and Manufacture, 143, 23-37(2019).

[19] BIFANO T G, DOW T A, SCATTERGOOD R O. Ductile-regime grinding： a new technology for machining brittle materials[J]. Journal of Engineering for Industry, 113, 184-189(1991).

[20] HUANG H, LAWN B R, COOK R F et al. Critique of materials-based models of ductile machining in brittle solids[J]. Journal of the American Ceramic Society, 103, 6096-6100(2020).

[21] ARIF M, ZHANG X Q, RAHMAN M et al. A predictive model of the critical undeformed chip thickness for ductile-brittle transition in nano-machining of brittle materials[J]. International Journal of Machine Tools and Manufacture, 64, 114-122(2013).

[22] VENKATACHALAM S, LI X, LIANG S Y. Predictive modeling of transition undeformed chip thickness in ductile-regime micro-machining of single crystal brittle materials[J]. Journal of Materials Processing Technology, 209, 3306-3319(2009).

[23] LI H G, GAO S, KANG R K et al. The Deformation Pattern of Aluminum Nitride Ceramics Under Nanoscratching[M]. Proceedings of the 7th International Conference on Nanomanufacturing （nanoMan2021）, 285-297(2022).

[24] JIANG W, CHENG X W, CAI H et al. The response of yttrium aluminum garnet （YAG） grains and grain boundaries to nanoindentation[J]. Journal of Materials Science, 53, 16198-16206(2018).

[25] LI C, ZHANG F H, WANG X et al. Investigation on surface/subsurface deformation mechanism and mechanical properties of GGG single crystal induced by nanoindentation[J]. Applied Optics, 57, 3661-3668(2018).

[26] WANG H M, HUANG Z Y, LU Z W et al. Determination of the elastic and plastic deformation behaviors of Yb： Y₃Al₅O₁₂ transparent ceramic by nanoindentation[J]. Journal of Alloys and Compounds, 682, 35-41(2016).

[27] HUANG Y, ZHANG F, HWANG K C et al. A model of size effects in nano-indentation[J]. Journal of the Mechanics and Physics of Solids, 54, 1668-1686(2006).

[28] PHARR G M, HERBERT E G, GAO Y F. The indentation size effect： a critical examination of experimental observations and mechanistic interpretations[J]. Annual Review of Materials Research, 40, 271-292(2010).

[29] LI C, ZHANG F H, PIAO Y C. Strain-rate dependence of surface/subsurface deformation mechanisms during nanoscratching tests of GGG single crystal[J]. Ceramics International, 45, 15015-15024(2019).

[30] GAO S, LI H G, KANG R K et al. Effect of strain rate on the deformation characteristic of AlN ceramics under scratching[J]. Micromachines, 12, 77(2021).

[31] OLIVER W C, PHARR G M. An improved technique for determining hardness and elastic modulus using load and displacement sensing indentation experiments[J]. Journal of Materials Research, 7, 1564-1583(1992).

[32] PATHAK S, KALIDINDI S R. Spherical nanoindentation stress-strain curves[J]. Materials Science and Engineering, 91, 1-36(2015).

[33] LAWN B R, EVANS A G. A model for crack initiation in elastic/plastic indentation fields[J]. Journal of Materials Science, 12, 2195-2199(1977).

[34] MAH T I, PARTHASARATHY T A. Effects of temperature， environment， and orientation on the fracture toughness of single-crystal YAG[J]. Journal of the American Ceramic Society, 80, 2730-2734(1997).

[35] ZHANG Y, KANG R K, GAO S et al. A new model of grit cutting depth in wafer rotational grinding considering the effect of the grinding wheel， workpiece characteristics， and grinding parameters[J]. Precision Engineering, 72, 461-468(2021).

[36] YANG M, LI C H, ZHANG Y B et al. Maximum undeformed equivalent chip thickness for ductile-brittle transition of zirconia ceramics under different lubrication conditions[J]. International Journal of Machine Tools and Manufacture, 122, 55-65(2017).

[37] YIN L, VANCOILLE E Y J, RAMESH K et al. Surface characterization of 6H-SiC （0001） substrates in indentation and abrasive machining[J]. International Journal of Machine Tools and Manufacture, 44, 607-615(2004).

[38] [38] 马廉洁， 巩亚东， 顾立晨， 等. 可加工微晶玻璃陶瓷磨削表面成形机制［J］. 机械工程学报， 2017， 53（15）： 201-207. doi: 10.3901/jme.2017.15.201MAL J， GONGY D， GUL CH， et al. Mechanism of surface forming in grinding machinable glass ceramics［J］. Journal of Mechanical Engineering， 2017， 53（15）： 201-207.（in Chinese）. doi: 10.3901/jme.2017.15.201