As Moore′s Law nears its physical constraints, the pursuit of innovative techniques in integrated circuit (IC) fabrication intensifies, focusing on advanced processes and packaging methodologies. As a high-precision processing method without mechanical contact, laser technology has outstanding advantages in its micro-scale precise physical control capabilities. This paper delves into the diverse applications of laser technology within IC fabrication, including its pivotal role in EUV (extreme ultraviolet) lithography for advanced processes and its utilization in TSV (through dilicon vias), bonding/debonding, laser scribing, hidden cutting, and laser annealing—all of which are essential in advanced packaging technologies. This article summarizes the development prospects and challenges faced by laser technology in IC fabrication, points out the necessity of technological innovation and process improvement, and looks forward to how laser technology will help the IC industry achieve new breakthroughs and development.