[3] [3] Huang Y, Lin C, Ye Z H, et al. Reflow flip-chip bonding technology for infrared detectors[J].Journal of Micromechanics and Microengineering, 2015,25(8): 1-6.

[4] [4] Liao G, Du L, Su L, et al. Using RBF networks for detection and prediction of flip chip with missing bumps[J].Microelectronics Reliability, 2015,55: 2817-2825.

[8] [8] Kim Y H, Choi J H, Choietc K S. New Reflow Process for Indium Bump[C].SPIE, 1997,3061: 60-67.

[10] [10] Chu K, Lee J, Cho H, et al. Characteristics of Indium Bump for Flip-Chip Bonding Used in Polymeric-Waveguide Integrated Optical Interconnection Systems[J].Japanese Journal of Applied Physics, 2004,43(8): 5922-5927.