Journals Articles Conferences News About CLP
Submit a paper Email Alert
Search
Search
Articles
Journals
News
Advanced Search
Top Searches
2D MaterialsTransformation opticsQuantum PhotonicsSmall lasersSemiconductor UV PhotonicsSupersymmetric microring laser arrays

INFRARED, Volume. 46, Issue 7, 32(2025)

Study on the Influence of Indium Oxide on Flip-Chip Interconnect Quality and Its Removal Method

Hui WANG*, Xiao-yu FENG, Tian OUYANG, and Teng-da MA
Author Affiliations
  • North China Research Institute of Electro-Optics, Beijing 100015, China
    • show less
    AbstractGet PDF(in Chinese)
    Figures&Tables (0)
    Equations (0)
    References (4)
    Tools
    Paper Information
    Topics
    Figures & Tables(0)
    Tools

    Get Citation

    Copy Citation Text

    WANG Hui, FENG Xiao-yu, OUYANG Tian, MA Teng-da. Study on the Influence of Indium Oxide on Flip-Chip Interconnect Quality and Its Removal Method[J]. INFRARED, 2025, 46(7): 32

    Download Citation

    EndNote(RIS)BibTexPlain Text
    Set citation alerts for article
    Save article for my favorites
    Paper Information

    Category:

    Received: Oct. 20, 2024

    Accepted: Aug. 12, 2025

    Published Online: Aug. 12, 2025

    The Author Email: WANG Hui (wh19800356080@163.com)

    DOI:10.3969/j.issn.1672-8785.2025.07.005

    Topics

    laser devices and laser physics
    Lasers and Laser Optics
    Laser physics
    laser manufacturing
    Instrumentation, Measurement and Metrology