[1] Yang C, Cheng H H, Qu L T. Research advancement on laser micro-nano processing of new energy devices[J]. Chinese Journal of Lasers, 48, 1502004(2021).

[2] Xia J J, Yu J, Wang Z S et al. Scratch evolution for monocrystalline silicon during chemical-mechanical polishing[J]. Acta Optica Sinica, 42, 0912002(2022).

[3] Vorobyev A Y, Guo C L. Antireflection effect of femtosecond laser-induced periodic surface structures on silicon[J]. Optics Express, 19, A1031-A1036(2011).

[4] Ems H, Ndao S. Microstructure-alone induced transition from hydrophilic to hydrophobic wetting state on silicon[J]. Applied Surface Science, 339, 137-143(2015).

[5] Liu X Q, Chen Q D, Guan K M et al. Dry-etching-assisted femtosecond laser machining[J]. Laser & Photonics Reviews, 11, 1600115(2017).

[6] Ren Y M, Zhang Z Y. Surface of nanosecond laser polished single-crystal silicon improved by two-step laser irradiation[J]. Acta Optica Sinica, 42, 0714004(2022).

[7] Liu Z D, Qiu M B, Wang W et al. Research on electrical discharge machining characteristics and mode of providing power of germanium crystal[J]. Journal of Mechanical Engineering, 47, 177-182(2011).

[8] Arif M, Rahman M, San W Y. An experimental investigation into micro ball end-milling of silicon[J]. Journal of Manufacturing Processes, 14, 52-61(2012).

[9] Leancu R, Moldovan N, Csepregi L et al. Anisotropic etching of germanium[J]. Sensors and Actuators A: Physical, 46, 35-37(1995).

[10] Chen J, Dong P T, Di D et al. Anisotropic wet etching behaviors and characteristics of(110)-oriented silicon in TMAH solution with different surfactants[J]. Chinese Journal of Sensors and Actuators, 24, 185-189(2011).

[11] Allongue P, Jiang P, Kirchner V et al. Electrochemical micromachining of p-type silicon[J]. The Journal of Physical Chemistry B, 108, 14434-14439(2004).

[12] Zhao W Q, Yu Z S. Self-cleaning effect in high quality percussion ablating of cooling hole by picosecond ultra-short pulse laser[J]. Optics and Lasers in Engineering, 105, 125-131(2018).

[13] Wu T N, Wu Z P, He Y C et al. Femtosecond laser textured porous nanowire structured glass for enhanced thermal imaging[J]. Chinese Optics Letters, 20, 033801(2022).

[14] Yin K, Wu Z P, Wu J R et al. Solar-driven thermal-wind synergistic effect on laser-textured superhydrophilic copper foam architectures for ultrahigh efficient vapor generation[J]. Applied Physics Letters, 118, 211905(2021).

[15] Kanaujia P K, Bulbul A, Parmar V et al. Ultrafast laser based hybrid methodology of silicon microstructure fabrication for optoelectronic applications[J]. Applied Surface Science, 420, 63-69(2017).

[16] Luong K P, Tanabe-Yamagishi R, Yamada N et al. Laser-assisted wet etching of silicon back surfaces using 1552 nm femtosecond laser[J]. International Journal of Electrical Machining, 25, 7-13(2020).

[17] Zhang D S, Gökce B, Sommer S et al. Debris-free rear-side picosecond laser ablation of thin germanium wafers in water with ethanol[J]. Applied Surface Science, 367, 222-230(2016).

[18] Pan X N, Huang C Z, Wang J et al. Laser-assisted waterjet micro-grooving of silicon wafers for minimizing heat affected zone[J]. Materials Science Forum, 861, 133-138(2016).

[19] Zhu H, Wang J, Yao P et al. Heat transfer and material ablation in hybrid laser-waterjet microgrooving of single crystalline germanium[J]. International Journal of Machine Tools and Manufacture, 116, 25-39(2017).

[20] Yu P H, Wu K L, Lee S M et al. Effect of voltage supply mode on electrolytic machining of polycrystalline silicon[J]. Materials and Manufacturing Processes, 26, 1459-1465(2011).

[21] Morin F J, Maita J P. Conductivity and Hall effect in the intrinsic range of germanium[J]. Physical Review, 94, 1525-1529(1954).

[22] Geng R W, Yang X J, Xie Q M et al. Fundamental study on material removal mechanism in single-crystal germanium[J]. Infrared Physics & Technology, 116, 103773(2021).

[23] Arai N, Tsuji H, Hattori M et al. Luminescence properties of Ge implanted SiO2: Ge and GeO2: Ge films[J]. Applied Surface Science, 256, 954-957(2009).