High peak power density and low mechanical stress photonic-band-crystal diode laser array based on non-soldered packaging technology

Jing Liu; Mingjin Wang; Yufei Wang; Xuyan Zhou; Ting Fu; Aiyi Qi; Hongwei Qu; Xiaoxu Xing; Wanhua Zheng

doi:10.3788/COL202220.071403

Chinese Optics Letters, Volume. 20, Issue 7, 071403(2022)

High peak power density and low mechanical stress photonic-band-crystal diode laser array based on non-soldered packaging technology Editors' Pick

Jing Liu^1,2、*, Mingjin Wang¹, Yufei Wang^1,2,3,4, Xuyan Zhou¹, Ting Fu^1,2, Aiyi Qi^1,3, Hongwei Qu^1,2,3,4, Xiaoxu Xing^1,2, and Wanhua Zheng^{1,2,3,4,5、**}

Author Affiliations

¹Laboratory of Solid-State Optoelectronics Information Technology, Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083, China

²Center of Materials Science and Optoelectronics Engineering, University of Chinese Academy of Sciences, Beijing 100049, China

³State Key Laboratory on Integrated Optoelectronics, Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083, China

⁴College of Future Technology, University of Chinese Academy of Sciences, Beijing 101408, China

⁵School of Electronic, Electrical and Communication Engineering, University of Chinese Academy of Sciences, Beijing 100049, China

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Figures & Tables(14)

Fig. 1. Schematic of a single MCC diode laser.

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Fig. 2. Schematic of the vertical diode laser array.

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Fig. 3. Schematic of a single PBC laser emitter.

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Fig. 4. Far-field incoherent irradiance distribution of the two diode laser arrays. (a) Irradiance distribution of the PBC diode laser array. (b) Irradiance distribution of the conventional diode laser array.

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Fig. 5. Simulation model of the PBC laser bar.

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Fig. 6. Stress distribution of the two PBC diode laser bars. (a) Stress distribution of the bar with indium soldered. (b) Stress distribution of the bar with non-soldered.

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Fig. 7. Deformation distribution of the two PBC diode laser bars. (a) Deformation distribution of the bar with indium soldered. (b) Deformation distribution of the bar with non-soldered.

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Fig. 8. Temperature distribution of the two PBC diode laser bars. (a) Temperature distribution of the bar with indium soldered. (b) Temperature distribution of the bar with non-soldered.

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Fig. 9. Light spots in free transmission of the two diode laser bars. (a) Light spot of the conventional bar. (b) Light spot of the PBC bar.

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Fig. 10. (a) PBC diode laser array with two non-soldered bars. (b) P and N sides contact.

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Fig. 11. (a) Power, (b) slope efficiency, and (c) wavelength of the PBC diode laser arrays with non-soldered and indium soldered.

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Fig. 12. “Smile” of the PBC diode laser array with non-soldered. (a) The “smile.” (b) The optimized “smile.”

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Table 1. Parameters of PBC and Conventional Laser Bar

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Table 1. Parameters of PBC and Conventional Laser Bar

Parameters	PBC Laser Diode	Conventional Diode Laser
Fast axis divergence (FWHM)	15°	36°
Slow axis divergence (FWHM)	7°	7°
Emitter width in the slow axis	200 µm	200 µm
Number of emitters	19	19
Emitter pitch	500 µm	500 µm

Table 2. Parameters of Material Performance

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Table 2. Parameters of Material Performance

Material	Density ( $kg \cdot m^{- 3}$ )	CTE ( $10^{- 6} K^{- 1}$ )	Thermal Conductivity ( $W \cdot m^{- 1} \cdot K^{- 1}$ )	Poisson’s Ratio	Heat Capacity ( $J \cdot {kg}^{- 1} \cdot K^{- 1}$ )	Young’s Modulus (Pa)
Cu	8900	16.5	398	0.36	395	$1.3 \times 10^{11}$
GaAs	5330	6.4	44	0.30	325	$7.5 \times 10^{9}$
In	7310	33	81.6	0.45	230	$1.1 \times 10^{10}$
InSn	7300	20	34	0.45	230	$1.6 \times 10^{10}$

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Jing Liu, Mingjin Wang, Yufei Wang, Xuyan Zhou, Ting Fu, Aiyi Qi, Hongwei Qu, Xiaoxu Xing, Wanhua Zheng, "High peak power density and low mechanical stress photonic-band-crystal diode laser array based on non-soldered packaging technology," Chin. Opt. Lett. 20, 071403 (2022)

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Paper Information

Category: Lasers, Optical Amplifiers, and Laser Optics

Received: Jan. 28, 2022

Accepted: Apr. 24, 2022

Posted: Apr. 25, 2022

Published Online: May. 26, 2022

The Author Email: Jing Liu (jingliu@semi.ac.cn), Wanhua Zheng (whzheng@semi.ac.cn)

DOI:10.3788/COL202220.071403

Topics

laser devices and laser physics

Lasers and Laser Optics

Laser physics

laser manufacturing

Instrumentation, Measurement and Metrology