High peak power density and low mechanical stress photonic-band-crystal diode laser array based on non-soldered packaging technology

Jing Liu; Mingjin Wang; Yufei Wang; Xuyan Zhou; Ting Fu; Aiyi Qi; Hongwei Qu; Xiaoxu Xing; Wanhua Zheng

doi:10.3788/COL202220.071403

Chinese Optics Letters, Volume. 20, Issue 7, 071403(2022)

High peak power density and low mechanical stress photonic-band-crystal diode laser array based on non-soldered packaging technology Editors' Pick

Jing Liu^1,2、*, Mingjin Wang¹, Yufei Wang^1,2,3,4, Xuyan Zhou¹, Ting Fu^1,2, Aiyi Qi^1,3, Hongwei Qu^1,2,3,4, Xiaoxu Xing^1,2, and Wanhua Zheng^{1,2,3,4,5、**}

Author Affiliations

¹Laboratory of Solid-State Optoelectronics Information Technology, Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083, China

²Center of Materials Science and Optoelectronics Engineering, University of Chinese Academy of Sciences, Beijing 100049, China

³State Key Laboratory on Integrated Optoelectronics, Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083, China

⁴College of Future Technology, University of Chinese Academy of Sciences, Beijing 101408, China

⁵School of Electronic, Electrical and Communication Engineering, University of Chinese Academy of Sciences, Beijing 100049, China

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Jing Liu, Mingjin Wang, Yufei Wang, Xuyan Zhou, Ting Fu, Aiyi Qi, Hongwei Qu, Xiaoxu Xing, Wanhua Zheng, "High peak power density and low mechanical stress photonic-band-crystal diode laser array based on non-soldered packaging technology," Chin. Opt. Lett. 20, 071403 (2022)

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Paper Information

Category: Lasers, Optical Amplifiers, and Laser Optics

Received: Jan. 28, 2022

Accepted: Apr. 24, 2022

Posted: Apr. 25, 2022

Published Online: May. 26, 2022

The Author Email: Jing Liu (jingliu@semi.ac.cn), Wanhua Zheng (whzheng@semi.ac.cn)

DOI:10.3788/COL202220.071403

Topics

laser devices and laser physics

Lasers and Laser Optics

Laser physics

laser manufacturing

Instrumentation, Measurement and Metrology