Chinese Journal of Lasers, Volume. 47, Issue 3, 302003(2020)

Bottom-Up Drilling of Transparent Materials

Wang Haozhi1, Guo Pengfeng1, Wu Shuang1,2、*, Tao Sha1, Chen Wei1, and Zhao Xiaojie1,2
Author Affiliations
  • 1Inno Laser Technology Corporation Ltd., Shenzhen, Guangdong 518000, China
  • 2Jiangsu Weina Laser Application Technology Research Institute, Changzhou, Jiangsu 213000, China
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    References(4)

    [1] Du K M. Ready to work: solid state slab laser[J]. Laser Technik Journal, 7, 39-43(2010).

    [2] Du K M, Shi P. Subsurface precision machining of glass substrates by innovative lasers[J]. Glass Science and Technology, 76, 95-98(2003).

    [3] Karimelahi S, Abolghasemi L, Herman P R. Rapid micromachining of high aspect ratio holes in fused silica glass by high repetition rate picosecond laser[J]. Applied Physics A, 114, 91-111(2014).

    [4] Lott G, Falletto N, Devilder P J et al. Optimizing the processing of sapphire with ultrashort laser pulses[J]. Journal of Laser Applications, 28, 022206(2016).

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    Wang Haozhi, Guo Pengfeng, Wu Shuang, Tao Sha, Chen Wei, Zhao Xiaojie. Bottom-Up Drilling of Transparent Materials[J]. Chinese Journal of Lasers, 2020, 47(3): 302003

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    Paper Information

    Category: laser manufacturing

    Received: Sep. 14, 2019

    Accepted: --

    Published Online: Mar. 12, 2020

    The Author Email: Shuang Wu (wushuang@inno-laser.com)

    DOI:10.3788/CJL202047.0302003

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