Fig. 1. Schematic and photo of experimental setup. (a) Schematic; (b) photo

Fig. 2. Cut results of glass slide at different scan times with nanosecond green laser bottom-up processing. (a) 5 times; (b) 10 times; (c) 15 times; (d) 20 times; (e) 25 times; (f) 28 times, cut through

Fig. 3. Relationship between scan times and kerf depth

Fig. 4. Bottom-up drilling using green laser with pulse width of 12 ns. (a) Entrance; (b) exit

Fig. 5. Bottom-up drilling using green laser with pulse width of 2 ns. (a) Entrance; (b) exit

Fig. 6. Bottom-up drilling using picosecond infrared laser. (a) Entrance; (b) exit

Fig. 7. Bottom-up drilling using femtosecond green laser. (a) Entrance; (b) exit

Fig. 8. Relation between cutting efficiency or chipping length and pulse width for two cutting methods

Fig. 9. Relationship between ablation efficiency and pulse width when drilling in brittle materials using top-down method

Fig. 10. Chippings generated when glass is processed by picosecond and nanosecond laser with bottom-up method. (a) Picosecond laser; (b) nanosecond laser