Fig. 1. Schematics of massive pick-up transfer methods. (a) Triple roll-transfer method^[24]; (b) laser-assisted transfer method^[27]

Fig. 2. Microfluidics and self-aligning transfer technologies. (a) Schematic diagram of magnetic-force-assisted fluidic assembly process^[32]; (b) adhesion-force-improved fluid self-assembly technology^[33]; (c) electromagnetic self-align transfer method^[27]

Fig. 3. Wafer level epitaxial growth for full-color Micro-LED. (a) Epitaxial growth of multilayer GaN nanostructures and fabrication of color tunable Micro-LED^[37]; (b) epitaxial growth of blue LED on yellow LED structure for multi-color mixed light integration^[42]

Fig. 4. Vertical stacking for full color integration of Micro-LED. (a) Two-dimensional material-assisted transfer technology for vertical stacking Micro-LED full color integration^[45]; (b) wafer-scale full color Micro-LED arrays driven by two-dimensional material integrated circuit^[36]

Fig. 5. Preparation of QD color conversion pixels using photolithography technology. (a) Full color Micro-LED achieved by red and green color filter material/quantum dot photoresist laminates^[59]; (b) full color Micro-LED achieved by red color QD color conversion pixel^[60]; (c) full color Micro-LED achieved by red and green QD photoetching pixels within sub-5 μm^[63]

Fig. 6. Manufacturing technology for QD pixels. (a) Preparation of perovskite QD pixels through restricted growth^[64]; (b) flexible template-assisted transfer printing for patterned QD films^[52]; (c) preparation of QD color conversion layer using inkjet printing technology^[66]; (d) microfluidic technology for QD color conversion pixels^[67]