[1] [1] V Innocenzi, S Zueva, M Prisciandaro, et al. Treatment of TMAH solutions from the microelectronics industry: A combined process scheme［J］. Journal of Water Process Engineering, 2019, 31: 5-10.

          V Innocenzi, S Zueva, M Prisciandaro, et al. Treatment of TMAH solutions from the microelectronics industry: A combined process scheme［J］. Journal of Water Process Engineering, 2019, 31: 5-10.

[2] [2] Sandera, Josef. Connection of electronic and microelectronic modules［J］. Microelectronics International, 2014, 31(2): 13-16.

          Sandera, Josef. Connection of electronic and microelectronic modules［J］. Microelectronics International, 2014, 31(2): 13-16.

[3] [3] GAN Yun-han. Research on the development strategy of microelectronics technology and industry in China ［J］. China New Telecommunications, 2018, 20(4): 220-221.

          GAN Yun-han. Research on the development strategy of microelectronics technology and industry in China ［J］. China New Telecommunications, 2018, 20(4): 220-221.

[4] [4] FENG Xiao-jia. On the development of microelectronics in China ［J］. Information Recording Materials, 2019, 20(6): 79-80.

          FENG Xiao-jia. On the development of microelectronics in China ［J］. Information Recording Materials, 2019, 20(6): 79-80.

[5] [5] CHEN Xin-Hua, LIU Li, LIU Ying-kun. Research of china semiconductor industrial development program during the 12th five-year plan period ［J］. Semiconductor Technology, 2014, 39(6): 401-409.

          CHEN Xin-Hua, LIU Li, LIU Ying-kun. Research of china semiconductor industrial development program during the 12th five-year plan period ［J］. Semiconductor Technology, 2014, 39(6): 401-409.

[6] [6] WANG Nan, JIANG Wei, YAN Wei, et al. Design of lithography machine intelligent control system［J］. Infrared and Laser Engineering, 2013, 42(S2): 317-322.

          WANG Nan, JIANG Wei, YAN Wei, et al. Design of lithography machine intelligent control system［J］. Infrared and Laser Engineering, 2013, 42(S2): 317-322.

[7] [7] Levenson M D. Solid State Technology , 1995 ;38(9): 81-88.

          Levenson M D. Solid State Technology , 1995 ;38(9): 81-88.

[8] [8] LI Zhong-min, ZHANG Hai-zhuang, ZHONG Gang, et al. Research of gamma correction and energy revision algorithm in CCD photograph law survey laser distant field facula ［J］. Optic & Optoelectronic Technology, 2011, 9(02): 19-21.

          LI Zhong-min, ZHANG Hai-zhuang, ZHONG Gang, et al. Research of gamma correction and energy revision algorithm in CCD photograph law survey laser distant field facula ［J］. Optic & Optoelectronic Technology, 2011, 9(02): 19-21.

[9] [9] DENG Wei-lin, GENG An-bing, LIANG Qing-wen. Laser energy uniform design based on aspheric lens ［J］. Optic & Optoelectronic Technology, 2010, 8(6): 48-51.

          DENG Wei-lin, GENG An-bing, LIANG Qing-wen. Laser energy uniform design based on aspheric lens ［J］. Optic & Optoelectronic Technology, 2010, 8(6): 48-51.

[10] [10] LI Chun-jing, CAO Yi-ping, CAI Wen-juan, et al. FPGA Implementation of laser energy rapid scanning ［J］. Optic & Optoelectronic Technology, 2018, 16(01): 21-26.

          LI Chun-jing, CAO Yi-ping, CAI Wen-juan, et al. FPGA Implementation of laser energy rapid scanning ［J］. Optic & Optoelectronic Technology, 2018, 16(01): 21-26.

[11] [11] 1A Erdmann, M. Arnz. The impact of aberration averaging during step-and-scan on the photolithographic process［J］. Microelectronic Engineering, 1998, 41.

          1A Erdmann, M. Arnz. The impact of aberration averaging during step-and-scan on the photolithographic process［J］. Microelectronic Engineering, 1998, 41.

[12] [12] LIANG Wen-qiang, ZHOU Jian, NIE Xiao-ming. Signal processing solution of laser Doppler velocimeter based on FPGA ［J］. High Power Laser and Particle Beams, 2015, 27(9): 111008.

          LIANG Wen-qiang, ZHOU Jian, NIE Xiao-ming. Signal processing solution of laser Doppler velocimeter based on FPGA ［J］. High Power Laser and Particle Beams, 2015, 27(9): 111008.

[13] [13] XUE Qian-nan, ZHANG Dao-yang, LI Ying, et al. Flight experiments and failure analysis of FPGA for anti-SEU at aviation altitudes ［J］. High Power Laser and Particle Beams, 2016, 28(12): 124102.

          XUE Qian-nan, ZHANG Dao-yang, LI Ying, et al. Flight experiments and failure analysis of FPGA for anti-SEU at aviation altitudes ［J］. High Power Laser and Particle Beams, 2016, 28(12): 124102.

[14] [14] LU Ming-teng, CAO Yi-ping. FPGA implementation of realtime location at variable scanning step using metrological grating ［J］. Tool Engineering, 2013, 47(473): 54-57.

          LU Ming-teng, CAO Yi-ping. FPGA implementation of realtime location at variable scanning step using metrological grating ［J］. Tool Engineering, 2013, 47(473): 54-57.

[15] [15] ZHAO Jun-jun. The noise analysis and design of the operational amplifier circuit ［J］. Electronic Test, 2018(16): 62-63.

          ZHAO Jun-jun. The noise analysis and design of the operational amplifier circuit ［J］. Electronic Test, 2018(16): 62-63.

[16] [16] WANG Jing, GUO Ting, LI Wei. Optimization design of the input stage of a precise low noise operational amplifier ［J］. Semiconductor Technology, 2019, 44(11): 846-851+875.

          WANG Jing, GUO Ting, LI Wei. Optimization design of the input stage of a precise low noise operational amplifier ［J］. Semiconductor Technology, 2019, 44(11): 846-851+875.

[17] [17] CHEN Jian-ping. Photonic analog-to-digital conversion technology ［J］. Optic & Optoelectronic Technology, 2019, 17(03): 8-13.

          CHEN Jian-ping. Photonic analog-to-digital conversion technology ［J］. Optic & Optoelectronic Technology, 2019, 17(03): 8-13.

[18] [18] CAI Wen-wei. The development status and countermeasures of IC design industry［J］. Technology and Economic Guide, 2019, 27(30): 200-201.

          CAI Wen-wei. The development status and countermeasures of IC design industry［J］. Technology and Economic Guide, 2019, 27(30): 200-201.

[19] [19] SUN Qian. On the design method of integrated circuit ［J］. Technology and Economic Guide, 2019, 27(1): 85.

          SUN Qian. On the design method of integrated circuit ［J］. Technology and Economic Guide, 2019, 27(1): 85.