Journal of Synthetic Crystals, Volume. 53, Issue 6, 967(2024)
Effect of SiC Wafer Grinding Process on Surface Damage
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XIE Guijiu, ZHANG Wenbin, WANG Yan, SONG Zhen, ZHANG Bing. Effect of SiC Wafer Grinding Process on Surface Damage[J]. Journal of Synthetic Crystals, 2024, 53(6): 967
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Received: Jan. 3, 2024
Accepted: --
Published Online: Aug. 22, 2024
The Author Email: ZHANG Wenbin (beezwb@163.com)
CSTR:32186.14.
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