Acta Photonica Sinica, Volume. 52, Issue 7, 0752309(2023)

Characteristics and Properties of Femtosecond Laser Drilling of Kevlar-29 Substrates

Jian CHENG1,2, Jiale LI1, Zhiwei ZHANG1, Sheng JIANG1, Peng ZHANG2, Zhongsheng ZHAI1,2, and Dun LIU1,2、*
Author Affiliations
  • 1School of Mechanical Engineering,Hubei University of Technology,Wuhan 430068,China
  • 2Hubei Key Laboratory of Modern Manufacturing Quality Engineering,Wuhan 430068,China
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    Figures & Tables(16)
    Schematic diagram of the femtosecond laser processing system(laser model:FemtoYL-50)
    Heat affected zone along the edge of the femtosecond laser drilled hole
    The taper diagram of AFRP after laser drilling
    Schematic of laser scanning trajectories of AFRP drilling
    Machining results with different laser scanning trajectories of AFRP drilling
    Surface morphology of holes at various repetition rates and laser power
    The trendline of HAZ under different repetition rates and laser power
    Surface morphology of holes under different laser powers and scanning velocities
    Scanning electron microscope image of hole edge of the laser drilled sample at 5 W@200 kHz
    Diameters of hole at different repetition rates
    Change of taper angles at different powers and repetition rates
    Hole wall morphology of AFRP after drilling with 100× magnification.
    Tensile fracture morphology of AFRP after drilling
    Tensile stress-elongation curve of AFRP after drilling
    Comparison of static tensile stress of AFRP between laser drilling and mechanical drilling
    • Table 1. Properties of Kevlar-29 substrate

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      Table 1. Properties of Kevlar-29 substrate

      MaterialsDensity/(g·cm-3Elastic modulus/GPaThermal expansion coefficient/(×10-6-1Decomposition temperature/KTensile strength/MPaInterlaminar shear strength/MPa
      Aramid fiber1.45112.42.78003 00048-69
      Epoxy resin1.1~1.31~256.8~62.4440650~850
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    Jian CHENG, Jiale LI, Zhiwei ZHANG, Sheng JIANG, Peng ZHANG, Zhongsheng ZHAI, Dun LIU. Characteristics and Properties of Femtosecond Laser Drilling of Kevlar-29 Substrates[J]. Acta Photonica Sinica, 2023, 52(7): 0752309

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    Paper Information

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    Received: Feb. 28, 2023

    Accepted: Apr. 18, 2023

    Published Online: Sep. 26, 2023

    The Author Email: Dun LIU (dun.liu@hbut.edu.cn)

    DOI:10.3788/gzxb20235207.0752309

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