Microelectronics, Volume. 55, Issue 1, 78(2025)

Simulation Study of Single-event Effects in 22 nm FDSOI Devices

HUNAG Kai, AIERKEN Abuduwayiti, BI Jinshun, LIU Xuefei, WANG Gang, LIU Mingqiang, and WANG Degui
Author Affiliations
  • School of Integrated Circuits, Guizhou Normal University, Guiyang 550025, P R China
  • show less

    This paper uses Synopsys Sentaurus TCAD to study single-event transients (SET) in 22 nm Fully-Depleted Silicon-On-Insulator (FDSOI) devices. The study first explores the impact of different LET values on SET characteristics. The results indicate that as LET increases from 10 MeV·cm2/mg to 35 MeV·cm2/mg, the peak transient current rises from 180 μA to 700 μA, and the pulse width extends from 10 ps to 13 ps, demonstrating the significant impact of higher LET values on single-event transients. The study also investigates the effect of different incident positions. When the single particle hits the source, gate, and drain electrode centers, the collected charges are 1.12 fC, 5.41 fC, and 2.22 fC, respectively. The gate collects the most charge, indicating it is the most sensitive area. Finally, the study examines three different bias voltages. In the off state, the devices exhibit the highest transient current (190 μA) and pulse width (16 ps), reflecting the most significant impact on single-event characteristics.

    Tools

    Get Citation

    Copy Citation Text

    HUNAG Kai, AIERKEN Abuduwayiti, BI Jinshun, LIU Xuefei, WANG Gang, LIU Mingqiang, WANG Degui. Simulation Study of Single-event Effects in 22 nm FDSOI Devices[J]. Microelectronics, 2025, 55(1): 78

    Download Citation

    EndNote(RIS)BibTexPlain Text
    Save article for my favorites
    Paper Information

    Special Issue:

    Received: Sep. 4, 2024

    Accepted: Jun. 19, 2025

    Published Online: Jun. 19, 2025

    The Author Email:

    DOI:10.13911/j.cnki.1004-3365.240304

    Topics