Microelectronics, Volume. 54, Issue 1, 17(2024)
Research Progress on Advanced Barrier Layer for Cu Interconnects
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ZHANG Xuefeng, DENG Bin, ZHANG Qingshan. Research Progress on Advanced Barrier Layer for Cu Interconnects[J]. Microelectronics, 2024, 54(1): 17
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Received: Aug. 6, 2023
Accepted: --
Published Online: Aug. 7, 2024
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