[1] Su Z X, Xing C Y, Luo B et al. Microsystem wafer-level 3D packaging based on composite glass-silicon substrate[J]. Navigation and Control, 18, 61-68(2019).

[2] Cheng H, Chen M X, Luo X B et al. Ceramic substrate for electronic packaging[J]. Advanced Ceramics, 40, 265-292(2019).

[3] Tamaki T, Watanabe W, Nishii J et al. Welding of transparent materials using femtosecond laser pulses[J]. Japanese Journal of Applied Physics, 44, L687-L689(2005).

[4] Sugioka K, Iida M, Takai H et al. Efficient microwelding of glass substrates by ultrafast laser irradiation using a double-pulse train[J]. Optics Letters, 36, 2734-2736(2011).

[5] Wu S Z, Wu D, Xu J et al. Absorption mechanism of the second pulse in double-pulse femtosecond laser glass microwelding[J]. Optics Express, 21, 24049-24059(2013).

[6] Watanabe W, Onda S, Tamaki T et al. Space-selective laser joining of dissimilar transparent materials using femtosecond laser pulses[J]. Applied Physics Letters, 89, 021106(2006).

[7] Ding T, Wang X H, Wang G D et al. Welding of fused silica by using high repetition frequency femtosecond laser[J]. Chinese Journal of Lasers, 45, 0701007(2018).

[8] de Pablos-Martín A, Höche T. Laser welding of glasses using a nanosecond pulsed Nd∶YAG laser[J]. Optics and Lasers in Engineering, 90, 1-9(2017).

[9] Xu Z J. Influence of filmthickness and silicon content to conductivity and residual stress of silicon substrate copper film[J]. Journal of Shaanxi Normal University (Natural Science Edition), 26, 198-200(1998).

[10] Belitzki A, Stadter C, Zaeh M F. Distortion minimization of laser beam welded components by the use of finite element simulation and artificial intelligence[J]. CIRP Journal of Manufacturing Science and Technology, 27, 11-20(2019).

[11] Yang X Y, Yan G Z, Xiu Y F et al. Welding temperature distribution and residual stresses in thick welded plates of SA738Gr.B through experimental measurements and finite element analysis[J]. Materials, 12, 2436(2019).

[12] Kelly A, Macmillan N H[M]. Strong solids(1973).