Glass was coated with copper films of different thicknesses by the vacuum evaporation method to realize the packaging technology for circuit manufacturing directly on glass substrate. Transient temperature and stress fields during welding of copper-plated glass were calculated using the ANSYS software. Welding experiments were conducted using a nanosecond ultraviolet laser, and the morphology and mechanical properties of welded joints were observed and tested. Theoretical calculations show that when the welding current intensity is 27 A, the average temperature of the copper film of the welding sample is approximately 3000 ℃, and the gasification speed of the copper film is slow; therefore, the welding effect is better. Thermal stresses are concentrated in the copper film whereas the thermal stress of glass is less than its theoretical strength. When the welding speed is 70 mm/s, the thermal stresses are the least. A copper film of thickness of 80 nm gives the highest welding sample tensile strength of 14.34 MPa. The optimal parameters of the laser welding process are the welding current intensity of 27 A, welding speed of 70 mm/s, and copper film thickness of 80 nm.