Journal of Infrared and Millimeter Waves, Volume. 40, Issue 2, 184(2021)

Three-dimensional structure analysis of Schottky barrier diode in CMOS technology for terahertz imaging

Da-Sheng CUI*, Jia-Ming YANG, Hong-Xuan YAO, and Xin LYU
Author Affiliations
  • Beijing Key Laboratory of Millimeter Wave and Terahertz Technology, School of Information and Electrics, Beijing Institute of Technology, Beijing 100081, China
  • show less
    Figures & Tables(10)
    Structure of two kinds of SBDs (a) shallow trench isolation SBD, (b) polysilicon gate separation SBD
    The three-dimensional structure and two-dimensional profile of polysilicon gate separation SBD
    Simulation result of the effect of l2 and l3 on resistance and capacitance (a) capacitance curve, (b) resistance curve
    Chip physical photo and the SBD plane diagram
    Measured RS and C0 for the 8 cells Schottky barrier diode
    Changes in ratio of FT with l2 and l3
    Photographs of the detector package box and the Chip
    Imaging test system (a) the 220 GHz imaging test setup, (b) the photo of 220 GHz imaging platform
    Imaging results of liquid level in a ceramic bottles
    • Table 1. Comparison of previous works

      View table
      View in Article

      Table 1. Comparison of previous works

      ProcessCut-off frequencyArticle
      CMOS 0.18 μm700 GHz13
      CMOS 0.13 μm1.2∼1.5 THz16
      CMOS 0.18 μm400 GHz17
      CMOS 0.18 μm800 GHz∼1 THzThis
    Tools

    Get Citation

    Copy Citation Text

    Da-Sheng CUI, Jia-Ming YANG, Hong-Xuan YAO, Xin LYU. Three-dimensional structure analysis of Schottky barrier diode in CMOS technology for terahertz imaging[J]. Journal of Infrared and Millimeter Waves, 2021, 40(2): 184

    Download Citation

    EndNote(RIS)BibTexPlain Text
    Save article for my favorites
    Paper Information

    Category: Research Articles

    Received: Jun. 29, 2020

    Accepted: --

    Published Online: Aug. 31, 2021

    The Author Email: Da-Sheng CUI (dscui@bit.edu.cn)

    DOI:10.11972/j.issn.1001-9014.2021.02.008

    Topics