Journal of Infrared and Millimeter Waves, Volume. 40, Issue 2, 184(2021)
Three-dimensional structure analysis of Schottky barrier diode in CMOS technology for terahertz imaging
Fig. 1. Structure of two kinds of SBDs (a) shallow trench isolation SBD, (b) polysilicon gate separation SBD
Fig. 2. The three-dimensional structure and two-dimensional profile of polysilicon gate separation SBD
Fig. 3. Simulation result of the effect of l2 and l3 on resistance and capacitance (a) capacitance curve, (b) resistance curve
Fig. 8. Imaging test system (a) the 220 GHz imaging test setup, (b) the photo of 220 GHz imaging platform
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Da-Sheng CUI, Jia-Ming YANG, Hong-Xuan YAO, Xin LYU. Three-dimensional structure analysis of Schottky barrier diode in CMOS technology for terahertz imaging[J]. Journal of Infrared and Millimeter Waves, 2021, 40(2): 184
Category: Research Articles
Received: Jun. 29, 2020
Accepted: --
Published Online: Aug. 31, 2021
The Author Email: Da-Sheng CUI (dscui@bit.edu.cn)