Chinese Journal of Lasers, Volume. 52, Issue 14, 1402115(2025)
Numerical Simulation of Multi‐Physics Coupling in Water‐Jet Guided Laser Machining for Monocrystalline Silicon (Invited)
Fig. 1. Schematic representation of the computational domain geometry, mesh and boundary conditions
Fig. 4. Comparison of the morphology of experimental and simulated holes for different numbers of pulses. (a1)‒(a3) Experimental results; (b1)‒(b3) simulated results; (c1)‒(c3) cross-section profile
Fig. 5. Temperature distributions at the end of the 20th pulse interval under different laser powers. (a) Temperature cloud map;
Fig. 7. Temperature distributions at the end of the 200th pulse interval for different water pressures. (a) Temperature cloud image;
Fig. 8. Maximum temperature variation of hole surface at different water pressures
Fig. 9. Maximum temperature variation of hole surface at different pulse frequencies
Fig. 10. Evolution of hole morphology and temperature at different pulse frequencies. (a1)‒(a3) Pulse frequency of 226 kHz;
Fig. 11. Variation of the maximum temperature of the hole surface under three laser parameter conditions
Fig. 12. Flow characteristics at the completion of the 200th pulse irradiation (th) and the completion of the pulse interval (tc) at different laser powers. (a1)(a2) Laser power of 119 W; (b1)(b2) laser power of 139 W; (c1)(c2) laser power of 159 W; (d1)(d2) laser power of 179 W
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Hui Jiao, Ping Huang, Guanghui Zhang, Xinping He, Zhichuang Chen, Yuxing Huang, Jia Zhou, Yuhong Long. Numerical Simulation of Multi‐Physics Coupling in Water‐Jet Guided Laser Machining for Monocrystalline Silicon (Invited)[J]. Chinese Journal of Lasers, 2025, 52(14): 1402115
Category: Laser Forming Manufacturing
Received: Apr. 28, 2025
Accepted: Jun. 19, 2025
Published Online: Jul. 14, 2025
The Author Email: Yuhong Long (longyuhong@guet.edu.cn)
CSTR:32183.14.CJL250748