Chinese Journal of Lasers, Volume. 52, Issue 14, 1402115(2025)

Numerical Simulation of Multi‐Physics Coupling in Water‐Jet Guided Laser Machining for Monocrystalline Silicon (Invited)

Hui Jiao, Ping Huang, Guanghui Zhang, Xinping He, Zhichuang Chen, Yuxing Huang, Jia Zhou, and Yuhong Long*
Author Affiliations
  • School of Mechanical and Electrical Engineering, Guilin University of Electronic Technology, Guilin 541010, Guangxi , China
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    Figures & Tables(14)
    Schematic representation of the computational domain geometry, mesh and boundary conditions
    Schematic diagram of the principle of WJGL processing
    Schematic diagram of WJGL coupled power monitoring
    Comparison of the morphology of experimental and simulated holes for different numbers of pulses. (a1)‒(a3) Experimental results; (b1)‒(b3) simulated results; (c1)‒(c3) cross-section profile
    Temperature distributions at the end of the 20th pulse interval under different laser powers. (a) Temperature cloud map;
    Maximum temperature variation of hole surface at different laser powers
    Temperature distributions at the end of the 200th pulse interval for different water pressures. (a) Temperature cloud image;
    Maximum temperature variation of hole surface at different water pressures
    Maximum temperature variation of hole surface at different pulse frequencies
    Evolution of hole morphology and temperature at different pulse frequencies. (a1)‒(a3) Pulse frequency of 226 kHz;
    Variation of the maximum temperature of the hole surface under three laser parameter conditions
    Flow characteristics at the completion of the 200th pulse irradiation (th) and the completion of the pulse interval (tc) at different laser powers. (a1)(a2) Laser power of 119 W; (b1)(b2) laser power of 139 W; (c1)(c2) laser power of 159 W; (d1)(d2) laser power of 179 W
    • Table 1. Thermophysical parameters of single crystal silicon[30]

      View table

      Table 1. Thermophysical parameters of single crystal silicon[30]

      PropertyContent
      Density ρ /(kg‧m-3Equation (15)
      Melting temperature Tm /K1687
      Vaporization temperature Tv /K3538
      Specific heat cp /(J‧kg-1‧K-1Equation (16)
      Thermal conductivity ks /(W‧m-1‧K-1Equation (17)
      Latent heat of melting Lm /(J‧kg-11.79×106
      Latent heat of vaporization Lv /(J‧kg-11.28×107
      Dynamic viscosity dv /(Pa‧s)0.0008
      Surface tension γ /(N‧m-10.783

      Surface tension coefficient with

      temperature γT /(N‧m-1‧K-1

      -2.79×10-4
      Coefficient of thermal expansion β /K-11.41×10-4
      Thermal diffusivity α /(m2‧s-1Equation (18)
      Emissivity εsEquation (19)
      Reflectivity RfTEquation (20)
    • Table 2. Thermophysical properties of water

      View table

      Table 2. Thermophysical properties of water

      PropertyValue
      Density ρw /(kg‧m-31000
      Thermal conductivity kw /(W‧m-1‧K-10.674
      Specific heat capacity cw /(J‧kg-1‧K-14180
      Kinematic viscosity μw /(m2‧s-18.9×10-7
      Dynamic viscosity ηw /(Pa‧s)8.9×10-4
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    Hui Jiao, Ping Huang, Guanghui Zhang, Xinping He, Zhichuang Chen, Yuxing Huang, Jia Zhou, Yuhong Long. Numerical Simulation of Multi‐Physics Coupling in Water‐Jet Guided Laser Machining for Monocrystalline Silicon (Invited)[J]. Chinese Journal of Lasers, 2025, 52(14): 1402115

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    Paper Information

    Category: Laser Forming Manufacturing

    Received: Apr. 28, 2025

    Accepted: Jun. 19, 2025

    Published Online: Jul. 14, 2025

    The Author Email: Yuhong Long (longyuhong@guet.edu.cn)

    DOI:10.3788/CJL250748

    CSTR:32183.14.CJL250748

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