Sapphire Through‐Hole Machining with 355 nm All‐Solid‐State Ultraviolet Nanosecond Laser

Ye Ma; Cheng Lei; Ting Liang; Pengfei Ji; Yuqiao Liu; Bingyan Wang; Guofeng Chen

doi:10.3788/CJL221348

Chinese Journal of Lasers, Volume. 50, Issue 4, 0402022(2023)

Sapphire Through‐Hole Machining with 355 nm All‐Solid‐State Ultraviolet Nanosecond Laser

Ye Ma¹, Cheng Lei^1、*, Ting Liang^1、**, Pengfei Ji¹, Yuqiao Liu¹, Bingyan Wang², and Guofeng Chen²

Author Affiliations

¹State Key Laboratory of Dynamic Measurement Technology, North University of China, Taiyuan 030051, Shanxi, China

²Inner Mongolia Power Machinery Institute, Hohhot 010010, Inner Mongolia, China

show less

Abstract Get PDF(in Chinese)

Cited By

Article index updated: Mar. 10, 2025

The article is cited by 2 article(s) CLP online library. (Some content might be in Chinese.)

Tools

Get Citation

Copy Citation Text

Ye Ma, Cheng Lei, Ting Liang, Pengfei Ji, Yuqiao Liu, Bingyan Wang, Guofeng Chen. Sapphire Through‐Hole Machining with 355 nm All‐Solid‐State Ultraviolet Nanosecond Laser[J]. Chinese Journal of Lasers, 2023, 50(4): 0402022

Download Citation

EndNote(RIS)BibTex Plain Text

Set citation alerts for article

Save article for my favorites

Paper Information

Category: laser manufacturing

Received: Oct. 21, 2022

Accepted: Nov. 15, 2022

Published Online: Feb. 2, 2023

The Author Email: Lei Cheng (leicheng@nuc.edu.cn), Liang Ting (liangtingnuc@nuc.edu.cn)

DOI:10.3788/CJL221348

Topics

laser devices and laser physics

Lasers and Laser Optics

Laser physics

laser manufacturing

Instrumentation, Measurement and Metrology