Microelectronics, Volume. 55, Issue 1, 165(2025)

Study on Application of EOTPR on Semiconductor Advanced Packaging

CHEN Xuanlong1,2, KONG Genyong1,2, SHI Gaoming1,2, HE Guanghui1,2, LIU Jiahao1, LIN Xiaoling1, and LI Chao1
Author Affiliations
  • 1The 5th Electronics Research Institute, Ministry of Industry and Information Technology, Guangzhou 511370, P. R. China
  • 2Reliability Research and Analysis Centre, China CEPREI Laboratory, Guangzhou 511370, P. R. China
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    CHEN Xuanlong, KONG Genyong, SHI Gaoming, HE Guanghui, LIU Jiahao, LIN Xiaoling, LI Chao. Study on Application of EOTPR on Semiconductor Advanced Packaging[J]. Microelectronics, 2025, 55(1): 165

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    Paper Information

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    Received: May. 1, 2024

    Accepted: Jun. 19, 2025

    Published Online: Jun. 19, 2025

    The Author Email:

    DOI:10.13911/j.cnki.1004-3365.240094

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