Semiconductor Optoelectronics, Volume. 45, Issue 5, 726(2024)
Research on Temperature Sensing Characteristics of FBG Packaged with Glass Solder
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YANG Wukun, ZHANG Yumin, SONG Yanming, TIAN Jing, WANG Du. Research on Temperature Sensing Characteristics of FBG Packaged with Glass Solder[J]. Semiconductor Optoelectronics, 2024, 45(5): 726
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Received: May. 21, 2024
Accepted: Feb. 13, 2025
Published Online: Feb. 13, 2025
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