Research on Temperature Sensing Characteristics of FBG Packaged with Glass Solder

YANG Wukun; ZHANG Yumin; SONG Yanming; TIAN Jing; WANG Du

doi:10.16818/j.issn1001-5868.2024052102

Semiconductor Optoelectronics, Volume. 45, Issue 5, 726(2024)

Research on Temperature Sensing Characteristics of FBG Packaged with Glass Solder

YANG Wukun¹, ZHANG Yumin^1,2, SONG Yanming^1,2, TIAN Jing¹, and WANG Du^1,2

¹Beijing Engineering Research Center of Optoelectronic Information and Instruments, Beijing Information Science & Technology University, Beijing 100192, CHN

²Beijing Laboratory of Optical Fiber Sensing and System, Beijing Information Science & Technology University, Beijing 100016, CHN

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YANG Wukun, ZHANG Yumin, SONG Yanming, TIAN Jing, WANG Du. Research on Temperature Sensing Characteristics of FBG Packaged with Glass Solder[J]. Semiconductor Optoelectronics, 2024, 45(5): 726

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Received: May. 21, 2024

Accepted: Feb. 13, 2025

Published Online: Feb. 13, 2025

The Author Email:

DOI:10.16818/j.issn1001-5868.2024052102

Topics

laser devices and laser physics

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