Through-hole Processing and Filling Technology for Glass Substrates in Chip Packaging

ZHANG Xingzhi; TIAN Yingliang; ZHAO Zhiyong; ZHANG Xun

doi:10.13588/j.cnki.g.e.2096-7608.2025.06.005

Glass Enamel & Ophtalmic Optics, Volume. 53, Issue 6, 26(2025)

Through-hole Processing and Filling Technology for Glass Substrates in Chip Packaging

ZHANG Xingzhi¹, TIAN Yingliang^1,2、*, ZHAO Zhiyong^1,2, and ZHANG Xun^1,3

Author Affiliations

¹College of Materials Science and Engineering, Beijing University of Technology, Beijing 100124, China

²National Engineering Research Center of FPD Glass Technology, Xianyang 712021, China

³WG Tech (Jiangxi) Group Co., Ltd., Xinyu 338004, China

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ZHANG Xingzhi, TIAN Yingliang, ZHAO Zhiyong, ZHANG Xun. Through-hole Processing and Filling Technology for Glass Substrates in Chip Packaging[J]. Glass Enamel & Ophtalmic Optics, 2025, 53(6): 26

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Paper Information

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Received: Aug. 4, 2024

Accepted: Jul. 30, 2025

Published Online: Jul. 30, 2025

The Author Email: TIAN Yingliang (tianyl@bjut.edu.cn)

DOI:10.13588/j.cnki.g.e.2096-7608.2025.06.005

Topics

laser devices and laser physics

Lasers and Laser Optics

Laser physics

laser manufacturing

Instrumentation, Measurement and Metrology