The processing and filling of through-holes in glass substrates are crucial technologies for fabrication of high-quality through glass via (TGV), which were essential for the advancement and integration of modern electronic devices. This paper systematically summarized the processing and filling techniques of TGV. The through-hole processing methods discussed include sandblasting, electrochemical discharge machining, glass reflow process, laser ablation, and laser-induced etching. The filling techniques for through-holes encompassed electroplating and conductive paste filling. Considering the current status of TGV processing and filling technologies and their applications in the advanced packaging field, the future development directions of TGV technology were proposed.