Acta Optica Sinica, Volume. 45, Issue 17, 1720008(2025)
Research Progress of Heterogeneous Integrated Photonic Technology for Multi-Material Systems (Invited)
[27] Wang Y M, Shu H W, Han X Y. High-precision silicon-based integrated optical temperature sensor[J]. Chinese Optics, 14, 1355-1361(2021).
[53] Tian Y H, Yuan M R, Qin S J et al. Thin film lithium niobate on-chip integration of multi-dimensional multiplexed photonic devices (invited)[J]. Laser & Optoelectronics Progress, 61, 1116004(2024).
[54] Zhang H J, Pang B N, Zheng D H et al. Fabrication of dammann grating devices using femtosecond laser direct writing assisted by plasma etching[J]. Chinese Journal of Lasers, 51, 1801006(2024).
[106] Chen Y H, Yang C A, Wang T F et al. Research progress on mid-infrared antimonide semiconductor lasers and heterogeneous integration technology (invited)[J]. Chinese Journal of Lasers, 52, 0501012(2025).
[108] Marinins A, Hänsch S, Sar H et al. Wafer-scale hybrid integration of InP DFB lasers on Si photonics by flip-chip bonding with sub-300 nm alignment precision[J]. IEEE Journal of Selected Topics in Quantum Electronics, 29, 8200311(2023).
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Liheng Wang, Zhen Han, Shijing Qin, Yonghui Tian, Mingbin Yu. Research Progress of Heterogeneous Integrated Photonic Technology for Multi-Material Systems (Invited)[J]. Acta Optica Sinica, 2025, 45(17): 1720008
Category: Optics in Computing
Received: May. 30, 2025
Accepted: Jun. 30, 2025
Published Online: Sep. 3, 2025
The Author Email: Yonghui Tian (tianyh@lzu.edu.cn), Mingbin Yu (mingbin.yu@mksemicon.com)
CSTR:32393.14.AOS251182