Acta Optica Sinica, Volume. 45, Issue 17, 1720008(2025)

Research Progress of Heterogeneous Integrated Photonic Technology for Multi-Material Systems (Invited)

Liheng Wang1, Zhen Han1, Shijing Qin1, Yonghui Tian1、**, and Mingbin Yu2、*
Author Affiliations
  • 1School of Physical Science and Technology, Lanzhou University, Lanzhou 730000, Gansu , China
  • 2Shanghai Mingkun Semiconductor Co., Ltd., Shanghai 201800, China
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    [108] Marinins A, Hänsch S, Sar H et al. Wafer-scale hybrid integration of InP DFB lasers on Si photonics by flip-chip bonding with sub-300 nm alignment precision[J]. IEEE Journal of Selected Topics in Quantum Electronics, 29, 8200311(2023).

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    Liheng Wang, Zhen Han, Shijing Qin, Yonghui Tian, Mingbin Yu. Research Progress of Heterogeneous Integrated Photonic Technology for Multi-Material Systems (Invited)[J]. Acta Optica Sinica, 2025, 45(17): 1720008

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    Paper Information

    Category: Optics in Computing

    Received: May. 30, 2025

    Accepted: Jun. 30, 2025

    Published Online: Sep. 3, 2025

    The Author Email: Yonghui Tian (tianyh@lzu.edu.cn), Mingbin Yu (mingbin.yu@mksemicon.com)

    DOI:10.3788/AOS251182

    CSTR:32393.14.AOS251182

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