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Semiconductor Optoelectronics, Volume. 45, Issue 1, 117(2024)

High-reliability Bonding Process of Infrared Detector Chip

LI Junguang1,2,3, WANG Xiao2,3, QIAO Jun2,3, and LI Peng2,3
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    LI Junguang, WANG Xiao, QIAO Jun, LI Peng. High-reliability Bonding Process of Infrared Detector Chip[J]. Semiconductor Optoelectronics, 2024, 45(1): 117

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    Received: Sep. 22, 2023

    Accepted: --

    Published Online: Jun. 25, 2024

    The Author Email:

    DOI:10.16818/j.issn1001-5868.2023092202

    Topics

    laser devices and laser physics
    Lasers and Laser Optics
    Laser physics
    laser manufacturing
    Instrumentation, Measurement and Metrology