Metrology & Measurement Technology, Volume. 45, Issue 2, 56(2025)

Design of a dual⁃channel optical inspection system with large field of view for Micro⁃LED wafer defects

Yibo ZHANG, Wenjun HE, and Huimin HONG
Author Affiliations
  • College of Optoelectronic Engineering, Changchun University of Science and Technology, Changchun130022, China
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    References(14)

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    [5] SU H, LI W H, LI J L. Research progress of wafer⁃level Micro⁃LED chip detection technology. LCD and Display, 38, 582-594(2023).

    [6] ZHENG L L, GUO Z Q, WEI Y et al. Research on a camera⁃based microscopic imaging system to inspect the surface luminance of the micro⁃LED array. IEEE Access, 6, 51329-51336(2018).

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    [8] BEHRMAN K, FOUILLOUX J, IRELAND T et al. Early defect identification for micro light‐emitting diode displays via photoluminescent and cathodoluminescent imaging. Journal of the Society for Information Display, 29, 264-274(2021).

    [9] SZARVAS T, MOLNAR G, NADUDVARI G et al. Bulk micro⁃defect detection with low⁃angle illumination. The Review of Scientific Instruments, 92(2021).

    [10] FANG X, SHI Z. Wafer defect detection and classification algorithm based on convolutional neural network. Computer Engineering, 44, 218-223(2018).

    [11] SHU Y, LI B, LIN H. Quality safety monitoring of LED chips using deep learning⁃based vision inspection methods. Measurement, 168(2021).

    [12] DENG Q, ZHAO Z Y, LIN H. Design of dark field detection system for nanoparticles on wafer metal surface. China Laser, 50, 98-108(2023).

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    Yibo ZHANG, Wenjun HE, Huimin HONG. Design of a dual⁃channel optical inspection system with large field of view for Micro⁃LED wafer defects[J]. Metrology & Measurement Technology, 2025, 45(2): 56

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    Paper Information

    Category: New Techniques for Precision Measurement

    Received: Dec. 23, 2024

    Accepted: --

    Published Online: Jul. 23, 2025

    The Author Email:

    DOI:10.11823/j.issn.1674-5795.2025.02.06

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