[1] Song W D. Research status of ceramic substrate materials for electronic packaging[J]. Chinese Powder Industry, 25-27(2019).

[2] Zhou J G. Analysis of difficulties in alumina ceramic processing and selection of processing methods[J]. Chemical Enterprise Management, 148-149(2020).

[3] Xu Z M, Meng X K, Qu Y R et al. Process parameter optimization of Al2O3 ceramics milled with nanosecond pulsed laser[J]. Laser & Optoelectronics Progress, 56, 231404(2019).

[4] Ashkenasi D, Rosenfeld A, Varel H et al. Laser processing of sapphire with picosecond and sub-picosecond pulses[J]. Applied Surface Science, 120, 65-80(1997).

[5] Cheng H, Chen M X, Hao Z L et al. Progress of technologies and applications of ceramic substrate for the packaging of power electronics[J]. Electronic Components and Materials, 35, 7-11(2016).

[6] Sebastian M T, Ubic R, Jantunen H. Low-loss dielectric ceramic materials and their properties[J]. International Materials Reviews, 60, 392-412(2015).

[7] Zhang G L, Hao N, Yang Z G et al. Research progress of electronic packaging ceramics[J]. Journal of Ceramics, 42, 732-740(2021).

[8] Ji L F, Yan T Y, Jiang R et al. Picosecond laser precision processing of ceramic gear[J]. Laser & Optoelectronics Progress, 57, 111429(2020).

[9] Zhang R H, Li W N, Liu Y S et al. Machining parameter optimization of C/SiC composites using high power picosecond laser[J]. Applied Surface Science, 330, 321-331(2015).

[10] Liu Q, Meng F Z, Tian X L et al. Research progress of machining ceramics by abrasive water jet[J]. Tool Engineering, 52, 3-6(2018).

[11] Huang Y T, Qu X H. Research on application and development of machining technology for engineering ceramics[J]. Journal of Beijing Polytechnic College, 11, 18-21(2012).

[12] Jia Z X, Huang J G, Gao J Q et al. Study on laser cutting technology of Al2O3 ceramic[J]. Electromachining & Mould, 39-42, 64(2017).

[13] Zhang D M, Yuan G F, Xie B B. Experimental study on the quality of muti-pass laser cutting of Al2O3 ceramic assisted with water jet[J]. Applied Laser, 36, 67-71(2016).

[14] Ma L X, Wang L N, Guo J et al. Study on cutting alumina ceramics by novel hybrid laser and water-jet[J]. Foundry Technology, 40, 895-898(2019).

[15] Zhao J. Numerical simulation of laser cutting ceramic machining process[J]. Ceramics, 25-34(2019).

[16] Beausoleil C, Yazdani Sarvestani H, Katz Z et al. Deep and high precision cutting of alumina ceramics by picosecond laser[J]. Ceramics International, 46, 15285-15296(2020).

[17] Feng Y H. Research on laser processing technology and optimization of traditional ceramics[D](2020).

[18] Esmail I, Yazdani Sarvestani H, Gholipour J et al. Engineered net shaping of alumina ceramics using picosecond laser[J]. Optics & Laser Technology, 135, 106669(2021).

[19] Zhang F. UV laser micromachining technology and mechanism of electronic materials[D](2012).

[20] Wang X L, Jiang Z H, Wu B C. Technology of laser marking ceramics plate[J]. Journal of Shanghai Jiao Tong University, 31, 82-84(1997).

[21] Mei X S, Yang Z X, Zhao W Q. Laser hole drilling on surface of electronic ceramic substrates[J]. Chinese Journal of Lasers, 47, 0500011(2020).

[22] Bai J X, Li H J. V500 CO2 laser machine and its Al2O3 electronic ceramic substrate processing technology[J]. Ceramics, 31-33(2014).

[23] Küper S, Stuke M. Ablation of UV-transparent materials with femtosecond UV excimer laser pulses[J]. Microelectronic Engineering, 9, 475-480(1989).

[24] Hanada Y, Sugioka K, Miyamoto I et al. Double-pulse irradiation by laser-induced plasma-assisted ablation (LIPAA) and mechanisms study[J]. Applied Surface Science, 248, 276-280(2005).