High-Aspect Ratio Blind Cutting of Ultra-Thin Ceramic by Nanosecond Ultraviolet Laser

Xinghua Chen; Wenyuan Li; Youmin Rong; Yu Huang

doi:10.3788/LOP202259.0114010

Laser & Optoelectronics Progress, Volume. 59, Issue 1, 0114010(2022)

High-Aspect Ratio Blind Cutting of Ultra-Thin Ceramic by Nanosecond Ultraviolet Laser

Xinghua Chen, Wenyuan Li, Youmin Rong^*, and Yu Huang

School of Mechanical Science and Engineering, Huazhong University of Science and Technology, Wuhan , Hubei 430074, China

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Figures & Tables(14)

Fig. 1. Alumina substrate

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Fig. 2. UV nanosecond laser processing platform

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Fig. 3. Variations of average power and pulse energy with laser repetition frequency

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Fig. 4. Variations of slit width and depth with laser repetition frequency

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Fig. 5. Surface morphology of the slit under optical microscope

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Fig. 6. Scanning microscopy image of the slit surface with laser scanning speed of 0.07 m/s and repetition times of 25

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Fig. 7. Changes of slit width and depth at different scanning speeds and repetition times. (a) Slit width; (b) slit depth

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Fig. 8. Scanning microscopy images of the slit with different repetition times at a laser scanning speed of 0.5 m/s. (a) Repetition times of 10; (b) repetition times of 15; (c) repetition times of 20; (d) repetition times of 25; (e) repetition times of 30

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Fig. 9. Scanning microscopy image and three-dimensional topography of slit when scanning speed is 0.1 m/s and repetition times is 30

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Fig. 10. Slit morphology under the optimal parameter combination

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Table 1. Thermodynamic parameters of alumina substrate materials
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Table 1. Thermodynamic parameters of alumina substrate materials
Parameter Value
Thermal expansion coefficient /（10^-6 K） 5-7.5
Thermal conductivity /（W⋅m^-1⋅K^-1） 20-40
Dielectric constant 6-9
Density /（g⋅cm^-3） 3-4

Table 2. Relevant parameters of UV laser platform
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Table 2. Relevant parameters of UV laser platform
Parameter Value
Pulse width /ns ＜15
Focal spot size /μm 37
Ambient temperature /℃ 25
Spot diameter /mm ＜2
Roundness of focusing beam 85%

Table 3. Selected three levels under three factors in orthogonal table
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Table 3. Selected three levels under three factors in orthogonal table
Level Laser repetition frequency /kHz Laser scanning speed /（m⋅s^-1） Repetition times
1 40 0.07 15
2 50 0.1 20
3 60 0.2 25

Table 4. Calculation table of variance analysis of orthogonal test

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Table 4. Calculation table of variance analysis of orthogonal test

No.	Laser repetition frequency /kHz	Scanning speed /（m⋅s^-1）		Repetition times	Random value	Depth-to-width ratio		Slit depth /μm
	1	2		3	4	Depth-to-width ratio		Slit depth /μm
1	40	0.07		15	1	3.795		88.8
2	40	0.1		20	2	3.383		91.0
3	40	0.2		25	3	3.291		90.5
4	50	0.07		25	2	2.893		83.6
5	50	0.1		15	3	2.912		86.2
6	50	0.2		20	1	1.832		55.5
7	60	0.07		20	3	2.104		50.7
8	60	0.1		25	1	2.486		68.6
9	60	0.2		15	2	1.894		57.4
Average depth-to-width ratio						Average slit depth
	3.4897		2.9307	2.8670	2.7043	90.10	74.37	77.47	70.97
$\bar{T}$	2.5457		2.9270	2.4397	2.7233	75.10	81.93	67.97	77.33
	2.1613		2.3390	2.8900	2.7690	58.90	67.80	80.90	75.80
R	1.3284		0.5917	0.4503	0.0647	11.20	14.13	12.93	1.53

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Xinghua Chen, Wenyuan Li, Youmin Rong, Yu Huang. High-Aspect Ratio Blind Cutting of Ultra-Thin Ceramic by Nanosecond Ultraviolet Laser[J]. Laser & Optoelectronics Progress, 2022, 59(1): 0114010

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