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Chinese Journal of Lasers, Volume. 49, Issue 16, 1602002(2022)

Microscale Laser Shock Flattening of Ultrasmooth Electronic Copper Foil

Enlan Zhao1,2, Qingqing Wang1,2、*, Haifeng Yang1,2, and Yuxing Peng1,2
Author Affiliations
  • 1School of Mechatronic Engineering, China University of Mining and Technology, Xuzhou 221116, Jiangsu, China
  • 2Jiangsu Collaborative Innovation Center of Intelligent Mining Equipment, Xuzhou 221116, Jiangsu, China
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    Article index updated: Sep. 7, 2025

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    Enlan Zhao, Qingqing Wang, Haifeng Yang, Yuxing Peng. Microscale Laser Shock Flattening of Ultrasmooth Electronic Copper Foil[J]. Chinese Journal of Lasers, 2022, 49(16): 1602002

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    Paper Information

    Category: laser manufacturing

    Received: Aug. 24, 2021

    Accepted: Nov. 22, 2021

    Published Online: Jul. 28, 2022

    The Author Email: Qingqing Wang (wangqingqing@cumt.edu.cn)

    DOI:10.3788/CJL202249.1602002

    Topics

    laser devices and laser physics
    Lasers and Laser Optics
    Laser physics
    laser manufacturing
    Instrumentation, Measurement and Metrology