Semiconductor Optoelectronics, Volume. 46, Issue 4, 742(2025)

Autofocus Window for Laser-Based Surface Microstructuring

ZHANG Jiajun1,2, YU Zhanjiang1,2, and LI Yiquan1,2
Author Affiliations
  • 1School of Mechanical and Electrical Engineering
  • 2Ministry of Education Key Laboratory for Cross-Scale Micro and Nano Manufacturing, Changchun University of Science and Technology, Changchun 130022, CHN
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    To address the shortcomings of the autofocus-window construction technology used in conventional focusing methods for laser processing, such as limited real-time performance, vulnerability to background noise, and considerable computational complexity in microtexture applications, this study proposes a saliency-window construction method. This method utilizes image saliency to isolate the region of interest for focus evaluation by integrating gradients and color cues. The main idea is to apply a visual saliency-detection framework when generating an autofocus window to suppress irrelevant background information and enhance the specificity of sharpness evaluation. A window-extraction algorithm combining Kirsch gradient analysis, LAB color-contrast calculation, local normalization, and texture suppression is introduced, thus enabling microtexture regions to be reliably depicted under brightness variations and complex modes. The method was experimentally verified on a laser microprocessing device. Compared with the conventional central-window method, the proposed method exhibits higher levels of sensitivity, steepness, and sharpness ratio by approximately 83%, 75%, and 54%, respectively, thereby enabling the generation of single-peak and fast-response focus curves and supporting stable microstructure manufacturing. Owing to its ability to balance between high precision and real-time performance, this saliency window provides an effective solution for the laser microprocessing platform.

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    ZHANG Jiajun, YU Zhanjiang, LI Yiquan. Autofocus Window for Laser-Based Surface Microstructuring[J]. Semiconductor Optoelectronics, 2025, 46(4): 742

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    Paper Information

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    Received: Jul. 2, 2025

    Accepted: Sep. 18, 2025

    Published Online: Sep. 18, 2025

    The Author Email:

    DOI:10.16818/j.issn1001-5868.20250702001

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