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Journal of Synthetic Crystals, Volume. 52, Issue 3, 365(2023)

Wire Saw Slicing and Its Application in Silicon Carbide Wafers Processing

ZHANG Junran1,2,3, ZHU Ruzhong2,3, ZHANG Xi2,3, ZHANG Xuqing2,3, GAO Yu4, LU Yunhao1, PI Xiaodong2,3、*, YANG Deren2,3, and WANG Rong2,3
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  • 1[in Chinese]
  • 2[in Chinese]
  • 3[in Chinese]
  • 4[in Chinese]
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    ZHANG Junran, ZHU Ruzhong, ZHANG Xi, ZHANG Xuqing, GAO Yu, LU Yunhao, PI Xiaodong, YANG Deren, WANG Rong. Wire Saw Slicing and Its Application in Silicon Carbide Wafers Processing[J]. Journal of Synthetic Crystals, 2023, 52(3): 365

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    Paper Information

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    Received: Oct. 12, 2022

    Accepted: --

    Published Online: Apr. 13, 2023

    The Author Email: Xiaodong PI (xdpi@zju.edu.cn)

    DOI:

    CSTR:32186.14.

    Topics

    laser devices and laser physics
    Lasers and Laser Optics
    Laser physics
    laser manufacturing
    Instrumentation, Measurement and Metrology