Electronics and Packaging, Volume. 25, Issue 7, 70105(2025)

Application of Glass Substrates in Co-Packaged Optics Technology

CHEN Junwei1, WEI Lai2, YANG Bin3, FAN Jiajie1、*, CUI Chengqiang3,4, and ZHANG Guoqi2
Author Affiliations
  • 1College of Intelligent Robotics and Advanced Manufacturing, Fudan University, Shanghai 200433, China
  • 2EEMCS Faculty, Delft University of Technology, Delft 2628 CD, the Netherlands
  • 3State Key Laboratory of Precision Electronic Manufacturing Technology and Equipment, Guangdong University of Technology, Guangzhou 510006, China
  • 4Guangdong Fozhixin Microelectronics Technology Research Co., Ltd., Foshan 528225, China
  • show less
    References(37)

    [1] [1] AHMED S R, BAGHDADI R, BERNADSKIY M, et al. Universal photonic artificial intelligence acceleration[J]. Nature, 2025, 640(8058): 368-374.

    [3] [3] HUA S Y, DIVITA E, YU S S, et al. An integrated large-scale photonic accelerator with ultralow latency[J]. Nature, 2025, 640(8058): 361-367.

    [6] [6] TIAN W C, HOU H H, DANG H J, et al. Progress in research on co-packaged optics[J]. Micromachines, 2024, 15(10): 1211.

    [7] [7] BROQUIN J E, HONKANEN S. Integrated photonics on glass: a review of the ion-exchange technology achievements[J]. Applied Sciences, 2021, 11(10): 4472.

    [9] [9] LAU J H. Co-packaged optics: heterogeneous integration of photonic integrated circuits and electronic integrated circuits[J]. Journal of Electronic Packaging, 2025, 147(1): 011004.

    [10] [10] MINKENBERG C, KRISHNASWAMY R, ZILKIE A, et al. Co-packaged datacenter optics: opportunities and challenges[J]. IET Optoelectronics, 2021, 15(2): 77-91.

    [11] [11] GE C, WANG X Y, DU J B, et al. High-speed wafer-level TGV interposer for 2.5D CPO[J]. Optics Communications, 2025, 579: 131517.

    [12] [12] MAHAJAN R, LI X Q, FRYMAN J, et al. Co-packaged photonics for high performance computing: status, challenges and opportunities[J]. Journal of Lightwave Technology, 2022, 40(2): 379-392.

    [13] [13] TAN M, XU J, LIU S Y, et al. Co-packaged optics (CPO): status, challenges, and solutions[J]. Frontiers of Optoelectronics, 2023, 16(1): 1.

    [14] [14] RAZDAN S, DE DOBBELAERE P, XUE J, et al. Advanced 2.5D and 3D packaging technologies for next generation silicon photonics in high performance networking applications[C]//2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), San Diego, CA, USA, 2022: 428-435.

    [15] [15] LIANG D, BOWERS J E. Recent progress in heterogeneous III-V-on-silicon photonic integration[J]. Light: Advanced Manufacturing, 2021, 2(1): 59-83.

    [16] [16] CHEN J W, LUO T, HUANG H B, et al. Glass-based encapsulant enabling SiC power devices to long-term operate at 300 ℃[J]. Applied Surface Science, 2025, 680: 161452.

    [17] [17] CHEN J W, CHEN W, ZHANG L Z, et al. Tuning the thermal and insulation properties of bismuth borate glass for SiC power electronics packaging[J]. Journal of the American Ceramic Society, 2024, 107(4): 2207-2216.

    [18] [18] CHEN J W, TIAN T C, GU C, et al. Review of inorganic nonmetallic materials in power electronics packaging application[J]. IEEE Transactions on Power Electronics, 2025, 40(8): 10509-10530.

    [20] [20] YAN W Y, ZHAO J, CHEN Y J, et al. Research on integration of photonic and electronic chips based on glass interposer (invited)[C]//2024 IEEE Region 10 Conference (TENCON), Singapore, 2024: 442-445.

    [21] [21] CHEN J W, CHEN C L, LAU K Y, et al. Nanoconfined synthesis of lead sulfide quantum dots embedded in mesoporous aluminosilicate glass with adjustable near-infrared broadband luminescence[J]. Chemistry of Materials, 2024, 36(3): 1113-1122.

    [22] [22] CHEN J W, LI A, ZHONG C, et al. Regulating the valence state of lead ions in lead aluminosilicate glass to improve the passivation performance for advanced chip packaging[J]. Applied Surface Science, 2024, 651: 159208.

    [23] [23] WEST B R. Ion-exchanged glass waveguide technology: a review[J]. Optical Engineering, 2011, 50(7): 071107.

    [24] [24] GE C, WANG X Y, DU J B, et al. 8-inch wafer level through glass via (TGV) interposer with 110-GHz bandwidth facing 128-GBaud 2.5D co-packaged optics (CPO)[C]//2024 Asia Communications and Photonics Conference (ACP) and International Conference on Information Photonics and Optical Communications (IPOC), Beijing, China, 2024: 1-4.

    [25] [25] LEE C C, CHUANG J C, YANG C T, et al. Simulation and metrological applications for RDL patterning development of glass substrate[C]//2024 IEEE 74th Electronic Components and Technology Conference (ECTC), Denver, CO, USA, 2024: 990-995.

    [26] [26] SCHRDER H, SCHWIETERING J, BTTGER G, et al. Hybrid photonic system integration using thin glass platform technology[J]. Journal of Optical Microsystems, 2021, 1(3): 033501.

    [27] [27] SCHRDER H, SCHWIETERING J, KIRSCH O, et al. Low-loss optical single-mode waveguide platform in thin glass with wide spectral range[C]//Optical Interconnects XXII, San Francisco, CA, USA, 2022.

    [28] [28] SCHIMPF A, BUCCI D, NANNINI M, et al. Photothermal microfluidic sensor based on an integrated Young interferometer made by ion exchange in glass[J]. Sensors and Actuators B: Chemical, 2012, 163(1): 29-37.

    [29] [29] BRUSBERG L, GRANADOS-BAEZ M, SCHILLING R D, et al. Optical design and applications for ion-exchanged glass waveguide circuits[J]. IEEE Transactions on Components, Packaging and Manufacturing Technology, 2025: 1.

    [30] [30] GUPTA P, MALLIK A K, KROHNERT K, et al. Thermal and electrical study of glass interposers in co-packaged electronic-photonic systems[J/OL]. IEEE Transactions on Components, Packaging and Manufacturing Technology [2025-07-23]. https://ieeexplore.ieee.org/document/10851341.

    [31] [31] ALLENET T, GEOFFRAY F, BUCCI D, et al. Microsensing of plutonium with a glass optofluidic device[J]. Optical Engineering, 2019, 58(6): 060502.

    [32] [32] CHOU B C, SATO Y, SUKUMARAN V, et al. Modeling, design, and fabrication of ultra-high bandwidth 3D glass photonics (3DGP) in glass interposers[C]//2013 IEEE 63rd Electronic Components and Technology Conference, Las Vegas, NV, USA, 2013: 286-291.

    [33] [33] BRUSBERG L, NEITZ M, PERNTHALER D, et al. Electro-optical circuit board with single-mode glass waveguide optical interconnects[C]//Optical Interconnects XVI, San Francisco, CA, USA, 2016: 97530J.

    [34] [34] NEITZ M, SCHNEIDER-RAMELOW M, SCHRDER H. Demonstration of glass-based photonic interposer for mid-board-optical engines and electrical-optical circuit board (EOCB) integration strategy[C]//Optical Interconnects XVIII, San Francisco, CA, USA, 2018: 105380D.

    [35] [35] SCHRDER H, KIRSCH O, WEBER D, et al. Photonic system-in-package (pSiP) by applying thin glass[C]//2023 IEEE CPMT Symposium Japan (ICSJ), Kyoto, Japan, 2023: 212-215.

    [36] [36] SCHWIETERING J, HERBST C, KIRSCH O, et al. Integrated optical single-mode waveguide structures in thin glass for flip-chip PIC assembly and fiber coupling[C]//2020 IEEE 70th Electronic Components and Technology Conference (ECTC), Orlando, FL, USA, 2020: 148-155.

    [37] [37] AL-SHAMI H, SCHWIETERING J, SCHRDER H. Automated highspeed characterization of optical waveguides in large-format glass substrates[C]//2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC), Berlin, Germany, 2024: 1-4.

    [38] [38] BRUSBERG L, GRENIER J R, MATTHIES J, et al. Passive aligned glass waveguide connector for co-packaged optics[C]//2021 European Conference on Optical Communication (ECOC), Bordeaux, France, 2021: 1-4.

    [39] [39] BRUSBERG L, GRENIER J R, ZAKHARIAN A R, et al. Glass platform for co-packaged optics[J]. IEEE Journal of Selected Topics in Quantum Electronics, 2023: 1-11.

    [40] [40] BRUSBERG L, GRENIER J R, KOCABAS S E, et al. Glass interposer for high-density photonic packaging[C]//Optical Fiber Communication Conference (OFC) 2022, San Diego, CA, USA, 2022.

    [41] [41] BRUSBERG L, DEJNEKA M J, OKORO C A, et al. Ultra low-loss ion-exchange waveguides in optimized alkali glass for co-packaged optics[C]//2024 IEEE 74th Electronic Components and Technology Conference (ECTC), Denver, CO, USA, 2024: 85-89.

    [42] [42] HOLGUN-LERMA J A, BRUSBERG L, YEARY L W, et al. Glass substrate with integrated adiabatic waveguide bends for high-density fiber-to-chip coupling[C]//Optical Interconnects and Packaging 2025, San Francisco, CA, USA, 2025: 1337209.

    Tools

    Get Citation

    Copy Citation Text

    CHEN Junwei, WEI Lai, YANG Bin, FAN Jiajie, CUI Chengqiang, ZHANG Guoqi. Application of Glass Substrates in Co-Packaged Optics Technology[J]. Electronics and Packaging, 2025, 25(7): 70105

    Download Citation

    EndNote(RIS)BibTexPlain Text
    Save article for my favorites
    Paper Information

    Category:

    Received: May. 7, 2025

    Accepted: Aug. 26, 2025

    Published Online: Aug. 26, 2025

    The Author Email: FAN Jiajie (jiajie_fan@fudan.edu.cn)

    DOI:10.16257/j.cnki.1681-1070.2025.0156

    Topics