Application of Glass Substrates in Co-Packaged Optics Technology

CHEN Junwei; WEI Lai; YANG Bin; FAN Jiajie; CUI Chengqiang; ZHANG Guoqi

doi:10.16257/j.cnki.1681-1070.2025.0156

Electronics and Packaging, Volume. 25, Issue 7, 70105(2025)

Application of Glass Substrates in Co-Packaged Optics Technology

CHEN Junwei¹, WEI Lai², YANG Bin³, FAN Jiajie^1、*, CUI Chengqiang^3,4, and ZHANG Guoqi²

Author Affiliations

¹College of Intelligent Robotics and Advanced Manufacturing, Fudan University, Shanghai 200433, China

²EEMCS Faculty, Delft University of Technology, Delft 2628 CD, the Netherlands

³State Key Laboratory of Precision Electronic Manufacturing Technology and Equipment, Guangdong University of Technology, Guangzhou 510006, China

⁴Guangdong Fozhixin Microelectronics Technology Research Co., Ltd., Foshan 528225, China

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CHEN Junwei, WEI Lai, YANG Bin, FAN Jiajie, CUI Chengqiang, ZHANG Guoqi. Application of Glass Substrates in Co-Packaged Optics Technology[J]. Electronics and Packaging, 2025, 25(7): 70105

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Paper Information

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Received: May. 7, 2025

Accepted: Aug. 26, 2025

Published Online: Aug. 26, 2025

The Author Email: FAN Jiajie (jiajie_fan@fudan.edu.cn)

DOI:10.16257/j.cnki.1681-1070.2025.0156

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