Acta Optica Sinica, Volume. 44, Issue 15, 1513011(2024)

Silicon Photoelectron Chip Integrated Active Devices Based on Colloidal Quantum Dots (Invited)

Junling Qu, Peng Liu, Xuetao Gan*, and Jianlin Zhao
Author Affiliations
  • School of Physical Science and Technology, Key Laboratory of Light Field Regulation and Information Perception, Ministry of Industry and Information Technology, Shaanxi Provincial Key Laboratory of Optical Information Technology, Northwestern Polytechnical University, Xi’an 710129, Shaanxi , China
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    References(129)

    [93] Marinins A, Hänsch S, Sar H et al. Wafer-scale hybrid integration of InP DFB lasers on Si photonics by flip-chip bonding with sub-300 nm alignment precision[J]. IEEE Journal of Selected Topics in Quantum Electronics, 29, 8200311(2023).

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    Junling Qu, Peng Liu, Xuetao Gan, Jianlin Zhao. Silicon Photoelectron Chip Integrated Active Devices Based on Colloidal Quantum Dots (Invited)[J]. Acta Optica Sinica, 2024, 44(15): 1513011

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    Paper Information

    Category: Integrated Optics

    Received: Jun. 2, 2024

    Accepted: Jul. 11, 2024

    Published Online: Aug. 5, 2024

    The Author Email: Gan Xuetao (xuetaogan@nwpu.edu.cn)

    DOI:10.3788/AOS241121

    CSTR:32393.14.AOS241121

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