[1] [1] KELLER C G, HOWE R T. Nickel-filled hexsil thermally actuated tweezers ［C］. The 8th International Conference on Solid-State Sensors and Actuators, Stockholm, 1995:376-379.

[2] [2] ROESSIG T A, HOWE R T, PISANO A P, et al.. Surface-micromachined resonant accelerometer ［C］.1997 International Conference on Solid-State Sensors and Actuators, Chicago,1997,6:859-862.

[3] [3] SU X P S, YANG H S, AGOGINO A M. A resonant accelerometer with two-stage microleverage mechanisms fabricated by SOI-MEMS technology ［J］. IEEE Sensors Journal, 2005,5(6):1214-1223.

[4] [4] QIU A P, ZHUNG R F, SHI Q. Structure design and simulation of micromechanical silicon oscillating accelerometer［J］. Journal of Chinese Inertial Technology, 2009,17(1):93-97.(in Chinese)

[5] [5] ROESSIG T A. Integrated MEMS tuning fork oscillators for sensor applications ［D］. Berkeley: University of California, UMI, 1998.

[6] [6] SU X P S. Compliant leverage mechanism design for MEMS application ［D］. Berkeley: University of California, Spring, 2001.

[7] [7] QIU A P, SU Y, SHI Q. Micro leverage design for micromechanical silicon oscillating accelerometer ［J］. Chinese Journal of Sensors and Actuators, 2006,19(5):2204-2207.(in Chinese)

[8] [8] SU X P S, YANG H S. Design of compliant microleverage mechanisms ［J］. Sensors and Actuators A, 2001,87:146-156.

[9] [9] SHI Q, QIU A P, SU Y, et al.. Mechanical coupling error of silicon microgyroscope ［J］. Opt. Precision Eng., 2008,16(5):893-898.(in Chinese)

[10] [10] WOJCIECHOWSKI K E, BOSER B E, PISANO A P. A MEMS resonant strain sensor operated in air ［C］. Proc. 17th Int. IEEE Micro Electro Mech. Syst. Conf., 2004,1:841-845.

[11] [11] LI J L, FANG J CH, SHENG W, et al.. Calculation and simulation of silicon MEMS gyroscope with dual-mass resonant output ［J］. Opt. Precision Eng., 2008,16(3):484-491.(in Chinese)

[12] [12] SHI Q, SU Y, QIU A P, et al.. Device level vacuum packaging technologies of MEMS gyroscopes ［J］. Opt. Precision Eng., 2009,17(8):1987-1992.(in Chinese)