Fig. 1. Schematic of electromagnetic‒thermal beam splitter applied in on-chip systems

Fig. 2. Simulation results. (a) Cross-sectional view of the magnetic field z-component distribution when a TM-polarized plane wave at 9 GHz frequency is incident on the electromagnetic‒thermal beam splitter; (b) cross-sectional view of the temperature field distribution when heat flux is incident on the electromagnetic‒thermal beam splitter from left to right

Fig. 3. Sections of z-component magnetic field distribution when TM-polarized plane wave is incident on the electromagnetic‒thermal beam splitter. (a) M=24, N=24; (b) M=29, N=19; (c) M=34, N=14

Fig. 4. Sections of temperature field distribution when heat flux is incident on the electromagnetic‒thermal beam splitter from left to right. (a) M=24, N=24; (b) M=29, N=19; (c) M=34, N=14

Fig. 5. Experimental environment and device diagram. (a) Schematic of experimental measurement environment of electromagnetic‒thermal beam splitter; (b) experimental device for beam splitting test of electromagnetic wave; (c) experimental device for beam splitting test of heat flow

Fig. 6. Curve of normalized magnetic field amplitude obtained from vector network analyzer

Fig. 7. Temperature field distribution recorded by thermal infrared camera. (a) t=1 min; (b) t=10 min; (c) t=20 min; (d) t=40 min