Microelectronics, Volume. 51, Issue 4, 592(2021)
Thermal Stress Analysis of Cu Interconnect Structure and Dielectric Material Selection Optimization
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LI Zhi, ZHANG Liwen, LI Na. Thermal Stress Analysis of Cu Interconnect Structure and Dielectric Material Selection Optimization[J]. Microelectronics, 2021, 51(4): 592
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Received: Nov. 15, 2020
Accepted: --
Published Online: Feb. 21, 2022
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